CY62167EV30LL-45ZXIT | Cypress Semiconductor

CY62167EV30LL-45ZXIT
Status: In Production

Datasheet

(pdf, 397.64 KB) RoHS PB Free

CY62167EV30LL-45ZXIT

Development KitN/A
Automotive QualifiedN
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.20
Part FamilyAsync Micropower (MoBL) SRAMs
Tape & ReelY

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$21.60 $18.17 $16.20 $14.24 $13.45 $12.57
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (9)

May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Apr 23, 2020
Qualification of UMC as an Alternate Wafer Fab Site for Select 16Mb MoBL SRAM Products
May 29, 2018
Manufacturing capacity constraints on select 90nm Asynchronous Cypress SRAM products and recommendations for alternatives
Feb 15, 2018
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (2)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update

Product Information Notice (PIN) (7)

Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Apr 14, 2020
90nm 16-Mbit (1M x 16/2M x 8) MoBL Industrial-Grade SRAM Product Family Datasheet Release
Nov 07, 2017
Qualification of OSE as an additional Test and Finish Location for Cypress Products
Nov 06, 2017
Addendum to PIN145281: Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels

White Papers (1)

VHDL (1)

Sep 02, 2009

IBIS (1)

Sep 02, 2009