CY62167DV30LL-70BVI | Cypress Semiconductor
CY62167DV30LL-70BVI
Status: In Production
Datasheet
(pdf, 327.87 KB)
CY62167DV30LL-70BVI
| Automotive Qualified | N |
| Density (Kb) | 16384 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating VCCQ (V) | 2.20 |
| Min. Operating Voltage (V) | 2.20 |
| Organization (X x Y) | 1M x 16 |
| Part Family | Async Micropower (MoBL) SRAMs |
| Speed (ns) | 70 |
| Tape & Reel | N |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $13.97 | $11.75 | $10.48 | $9.21 | $8.70 | $8.13 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
48
Package Dimensions
374 L x 1 H x 315 W (Mils)
Package Weight
158.56 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
210
Minimum Order Quantity (MOQ)
210
Order Increment
210
Estimated Lead Time (days)
49
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
220 (Cypress Reflow Profile)
RoHS Compliant
PB Free
N
Lead/Ball Finish
Sn/Pb
Marking
Package Material Declaration
Last Update: Nov 28, 2016
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 15, 2016
Technical Documents
Application Notes (2)
Product Change Notice (PCN) (12)
May 28, 2018
Change of wafer thickness from 11mils to 7mils for VFBGA packages assembled in CML Autoline
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
May 28, 2018
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab site for 16Mb, 3V MoBLTM SRAM, in R8NLD (0.13um) Process Technology
May 28, 2018
Add CML Autoline Philippines as Alternate Assembly Site for FBGA (1.2mm thick ) and VFBGA (1.0mm thick ) Pb-Free packages
Feb 15, 2018
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation