CY62167DV30LL-55ZXI | Cypress Semiconductor

CY62167DV30LL-55ZXI
Status: In Production

Datasheet

(pdf, 327.87 KB) RoHS PB Free

CY62167DV30LL-55ZXI

Automotive QualifiedN
Density (Kb)16384
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)x8 / x16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)55
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$22.24 $18.35 $17.01 $15.57 $14.90 $14.23
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
960
Minimum Order Quantity (MOQ)
192
Order Increment
192
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Last Update: Sep 15, 2016
Last Update: Sep 15, 2016

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (14)

May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 48 and 56 lead Pb-free TSSOP packages assembled at Cypress Manufacturing Limited (CML)
May 28, 2018
Qualification of MEMC WFR008P as a new vendor of starting material for wafer fabrication
May 28, 2018
Add Alternate Assembly Site for TSOP48 Pb-Free
May 28, 2018
Qualification of Grace Semiconductor Manufacturing Corporation (GSMC) as an Alternate Wafer Fab site for 16Mb, 3V MoBLTM SRAM, in R8NLD (0.13um) Process Technology
May 28, 2018
Qualification of 16M MoBLTM SRAM Devices in 90-nanometer Process Technology
May 27, 2018
Shipping Label Upgrade
Feb 15, 2018
16Mb Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 150- and 90-nanometer to 65-nanometer Technology
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 11, 2017
Qualification of PEAK Shipping Tray for 48-Lead TSOP I Products

Product Information Notice (PIN) (5)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of OSE as an additional Test and Finish Location for Cypress Products
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

White Papers (1)

IBIS (1)

Apr 03, 2012

VHDL (1)

Apr 02, 2012