CY62157EV30LL-45ZXI | Cypress Semiconductor

CY62157EV30LL-45ZXI
Status: In Production

Datasheet

(pdf, 735.12 KB) RoHS PB Free

CY62157EV30LL-45ZXI

Development KitN/A
Automotive QualifiedN
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.20
Part FamilyAsync Micropower (MoBL) SRAMs
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.88 $11.67 $10.41 $9.15 $8.64 $8.08
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 90 24-48 hours

Packaging/Ordering

Package
SOP
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
960
Minimum Order Quantity (MOQ)
192
Order Increment
192
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (11)

May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Apr 14, 2020
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial-Grade 8Mb MoBL SRAM Products
May 28, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 48 and 56 lead Pb-free TSSOP packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 11, 2017
Qualification of PEAK Shipping Tray for 48-Lead TSOP I Products

Advanced Product Change Notice (APCN) (3)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
2020 Annual Horizon Report Update

Product Information Notice (PIN) (2)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization

White Papers (1)

VHDL (1)

Sep 02, 2009

IBIS (1)

Sep 02, 2009