CY62157EV30LL-45ZXA | Cypress Semiconductor

CY62157EV30LL-45ZXA
Status: In Production

Datasheet

(pdf, 735.12 KB) RoHS PB Free

CY62157EV30LL-45ZXA

Development KitN/A
Automotive QualifiedY
Density (Kb)8192
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.20
Organization (X x Y)512K x 16
Speed (ns)45
Tape & ReelN
Temp. ClassificationAutomotive(A)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$13.29 $11.17 $9.97 $8.76 $8.27 $7.73
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
960
Minimum Order Quantity (MOQ)
96
Order Increment
96
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (5)

Feb 11, 2021
Addendum to PCN205104-Qualification of UMC as an Alternate Wafer Fab Site for Select Automotive Grade-3 8Mb MoBL® SRAM Products
Dec 21, 2020
Qualification of UMC as an Alternate Wafer Fab Site for Select Automotive Grade-3 8Mb MoBL® SRAM Products
Apr 14, 2020
Qualification of Cypress Bangkok as an Additional Assembly Site for Select 48-Lead TSOP I, 18.4x12x1.2mm, Pb-Free Products
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 11, 2017
Qualification of PEAK Shipping Tray for 48-Lead TSOP I Products

Advanced Product Change Notice (APCN) (7)

Nov 20, 2020
Q42020 Automotive Horizon Report Update
Jul 21, 2020
Q32020 Automotive Horizon Report Update
Apr 22, 2020
Q220 Automotive Horizon Report Update
Apr 14, 2020
Planned Qualification of New Assembly Sites for Select Automotive RAM Products
Apr 14, 2020
2020 Annual Automotive Horizon Update
Apr 14, 2020
Q419 Automotive Horizon Report Update
Apr 14, 2020
Q319 Automotive Horizon Report Update

Product Information Notice (PIN) (2)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization

White Papers (1)

VHDL (1)

Sep 02, 2009

IBIS (1)

Sep 02, 2009