CY62157EV30LL-45BVXI | Cypress Semiconductor

CY62157EV30LL-45BVXI
Status: In Production

Datasheet

(pdf, 735.12 KB) RoHS PB Free

CY62157EV30LL-45BVXI

Automotive QualifiedN
Density (Kb)8192
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)512K x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)45
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$12.01 $10.10 $9.01 $7.92 $7.48 $6.99
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
79.26 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
49
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (12)

May 08, 2020
Accelerated implementation schedules on PCN#s 084737, 094748-9, 094751, 094753-4 and 094757
Apr 14, 2020
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial-Grade 8Mb MoBL SRAM Products
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 29, 2018
Manufacturing capacity constraints on select 90nm Asynchronous Cypress SRAM products and recommendations for alternatives
May 29, 2018
Qualification of 6x8x1.0 mm 48 FBGA products at Cypress Philippines
May 28, 2018
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
May 28, 2018
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
May 27, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 20/24Leads SSOP package for standard, Pb-Free and Green package application assembled at Cypress "Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 48BGA 6x8x1.0mm Pb-Free Package with Sn98.5%Ag1%Cu0.5% Solder Ball Finish
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Advanced Product Change Notice (APCN) (2)

Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
2020 Annual Horizon Report Update

Product Information Notice (PIN) (4)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

White Papers (1)

VHDL (1)

Sep 02, 2009

IBIS (1)

Sep 02, 2009