CY62157ESL-45ZSXI | Cypress Semiconductor

CY62157ESL-45ZSXI
Status: In Production

Datasheet

(pdf, 497.07 KB) RoHS PB Free

CY62157ESL-45ZSXI

Automotive QualifiedN
Density (Kb)8192
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.20
Organization (X x Y)512K x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)45
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$14.41 $12.12 $10.81 $9.50 $8.97 $8.38
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
135
Minimum Order Quantity (MOQ)
135
Order Increment
135
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (11)

May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Qualification of an Alternative Tray for 44-Lead TSOP II Product Shipments
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (1)

Aug 23, 2020
Q32020 Horizon Report Update

Product Information Notice (PIN) (5)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products

White Papers (1)

VHDL (1)

Mar 15, 2012

IBIS (1)

Mar 01, 2012