CY62148EV30LL-45BVXI | Cypress Semiconductor
CY62148EV30LL-45BVXI
| Automotive Qualified | N |
| Density (Kb) | 4096 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating VCCQ (V) | 2.20 |
| Min. Operating Voltage (V) | 2.20 |
| Organization (X x Y) | 512K x 8 |
| Part Family | Async Micropower (MoBL) SRAMs |
| Speed (ns) | 45 |
| Tape & Reel | N |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $6.71 | $5.64 | $5.03 | $4.42 | $4.18 | $3.90 |
Packaging/Ordering
Package
No. of Pins
36
Package Dimensions
315 L x 1 H x 236 W (Mils)
Package Weight
80.11 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
56
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
IPC 1752 Material Declaration
Package Qualification Report
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Feb 13, 2019
Technical Documents
Application Notes (2)
Product Change Notice (PCN) (5)
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 28, 2018
Qualification of Sn (98.5%)/Ag (1.0%)/Cu (0.5%) Solder Ball Composition for 6x8x1.0mm, 8x9.5x1.0mm, 6x6x1.0mm, and 5x5x1.0mm VFBGA packages assembled at ASE-Taiwan
Product Information Notice (PIN) (4)
Jul 06, 2020
Datasheet Specification Changes for Select 4-Mbit MoBL® SRAM Industrial Parts
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization