CY62148ESL-55ZAXI | Cypress Semiconductor

CY62148ESL-55ZAXI
Status: In Production

Datasheet

(pdf, 282.38 KB) RoHS PB Free

CY62148ESL-55ZAXI

Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)512K x 8
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)55
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$8.03 $6.75 $6.02 $5.29 $5.00 $4.67
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 50 24-48 hours

Packaging/Ordering

Package
No. of Pins
32
Package Dimensions
460 L x 1 H x 315 W (Mils)
Package Weight
246.64 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
234
Minimum Order Quantity (MOQ)
234
Order Increment
234
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Package Qualification Report

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (9)

May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Addendum to PCN 115091-TSOP 8 X 13.4 Tray Modification (Bottom Pocket Fence)

Advanced Product Change Notice (APCN) (3)

Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Apr 14, 2020
2020 Annual Horizon Report Update

Product Information Notice (PIN) (5)

Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Manufacturing Label and Packing Configuration Standardization
Nov 07, 2017
Qualification of OSE as an additional Test and Finish Location for Cypress Products
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products

White Papers (1)

VHDL (1)

Sep 07, 2012

IBIS (1)

Mar 01, 2012