CY62147EV30LL-45BVI | Cypress Semiconductor

CY62147EV30LL-45BVI
Status: Obsolete

Datasheet

(pdf, 610.97 KB)

CY62147EV30LL-45BVI

Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.20
Min. Operating Voltage (V)2.20
Organization (X x Y)256K x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)45
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.71 $5.64 $5.03 $4.42 $4.18 $3.90
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
314 L x 1 H x 236 W (Mils)
Package Weight
92.70 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
N
Lead/Ball Finish
Sn/Pb

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (6)

Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 28, 2018
Qualification of 48 ball 6x8x1.0mm BGA Pb-Free and SnPb Solder Ball Packages Assembled at AIT
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for Ball Grid Array (BGA) Products

Product Information Notice (PIN) (4)

Jul 06, 2020
Datasheet Specification Changes for Select 4-Mbit MoBL® SRAM Industrial Parts
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (3)

May 11, 2020
Addendum to PTN195105A - January 2020 Product Obsolescence Notification
Apr 14, 2020
Addendum to PTN195105 - January 2020 Product Obsolescence Notification
Apr 14, 2020
January 2020 Product Obsolescence Notification

White Papers (1)

VHDL (1)

Sep 02, 2009

IBIS (1)

Sep 02, 2009