CY621472E30LL-45ZSXI | Cypress Semiconductor

Status: In Production


(pdf, 361.83 KB) RoHS PB Free


Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.20
Organization (X x Y)256K x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)45
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.93 $5.83 $5.20 $4.57 $4.32 $4.03
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 90 24-48 hours


No. of Pins
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
Package Carrier Drawing / Orientation
Standard Pack Quantity
Minimum Order Quantity (MOQ)
Order Increment
Estimated Lead Time (days)
HTS Code
ECCN Suball

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
PB Free
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (11)

Dec 20, 2020
Qualification of Greatek Electronics an Alternate Assembly Site for Select 44-Lead TSOP II Package
Sep 16, 2020
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial Grade 4Mb MoBL® SRAM Products
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Apr 14, 2020
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
Oct 31, 2017
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Qualification of an Alternative Tray for 44-Lead TSOP II Product Shipments
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (1)

Aug 23, 2020
Q32020 Horizon Report Update

Product Information Notice (PIN) (5)

Jul 06, 2020
Datasheet Specification Changes for Select 4-Mbit MoBL® SRAM Industrial Parts
Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products

VHDL (1)

Nov 28, 2014

IBIS (2)

Nov 28, 2014
Mar 01, 2012