CY62146ESL-45ZSXI | Cypress Semiconductor

CY62146ESL-45ZSXI
Status: In Production

Datasheet

(pdf, 387.16 KB) RoHS PB Free

CY62146ESL-45ZSXI

Automotive QualifiedN
Density (Kb)4096
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.20
Organization (X x Y)256K x 16
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)45
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$8.03 $6.75 $6.02 $5.29 $5.00 $4.67
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1350
Minimum Order Quantity (MOQ)
270
Order Increment
270
Estimated Lead Time (days)
70
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (15)

Mar 29, 2021
Qualification of Daewon Tray at ChipMOS Test and Finish Site for 44-Lead TSOP II Package Memory Products
Dec 20, 2020
Qualification of Greatek Electronics Inc.as an Alternate Assembly Site for Select 44-Lead TSOP II Package
Sep 16, 2020
Qualification of UMC as an Alternate Wafer Fab Site for Select Industrial Grade 4Mb MoBL® SRAM Products
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Apr 14, 2020
Qualification of OSE-T as an Additional Assembly Site for Select Pb-Free Products
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 31, 2017
4Mb FAST and Micropower (MoBL®) Asynchronous SRAM Products: Technology Transition from 250-, 180-, 130- and 90-nanometer to 65-nanometer Technology.
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Qualification of an Alternative Tray for 44-Lead TSOP II Product Shipments
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

White Papers (1)

VHDL (1)

Mar 15, 2012