CY62138FV30LL-45ZAXIT | Cypress Semiconductor

CY62138FV30LL-45ZAXIT
Status: In Production

Datasheet

(pdf, 727.31 KB) RoHS PB Free

CY62138FV30LL-45ZAXIT

Automotive QualifiedN
Density (Kb)2048
Frequency (MHz)N/A
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.20
Organization (X x Y)256K x 8
Part FamilyAsync Micropower (MoBL) SRAMs
Speed (ns)45
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$5.37 $4.51 $4.03 $3.54 $3.39 $3.20
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
32
Package Dimensions
460 L x 1 H x 315 W (Mils)
Package Weight
246.64 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1500
Minimum Order Quantity (MOQ)
1500
Order Increment
1500
Estimated Lead Time (days)
315
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (11)

Feb 14, 2021
Transfer of Assembly Operations to Greatek Electronics Inc. for Select 32-Lead TSOP I Package Memory Products
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (4)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Apr 14, 2020
2020 Annual Horizon Report Update

White Papers (1)

IBIS (1)

May 02, 2012

VHDL (1)

Sep 02, 2009