CY62137FV30LL-45ZSXA | Cypress Semiconductor
CY62137FV30LL-45ZSXA
| Development Kit | N/A |
| Automotive Qualified | Y |
| Density (Kb) | 2048 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 2.20 |
| Organization (X x Y) | 128K x 16 |
| Speed (ns) | 45 |
| Tape & Reel | N |
| Temp. Classification | Automotive(A) |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $7.57 | $6.36 | $5.68 | $4.99 | $4.71 | $4.40 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
1350
Minimum Order Quantity (MOQ)
135
Order Increment
135
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Technical Documents
Application Notes (2)
Product Change Notice (PCN) (5)
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 08, 2020
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products.
Apr 14, 2020
Qualification of OSE-T as an Additional Assembly Site for Select Automotive Products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Advanced Product Change Notice (APCN) (5)
Apr 14, 2020
Planned Qualification of New Assembly Sites for Select Automotive RAM Products
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
May 27, 2018
Qualification of ChipMOS Taiwan as an additional Burn-In, Test and Finish site for select automotive grade products in 44-pin TSOP II and 100-pin TQFP packages