CY62128ELL-55ZAXE | Cypress Semiconductor

CY62128ELL-55ZAXE
Status: In Production

Datasheet

(pdf, 907.93 KB) RoHS PB Free

CY62128ELL-55ZAXE

Development KitN/A
Automotive QualifiedY
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)125
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)4.50
Organization (X x Y)128K x 8
Speed (ns)55
Tape & ReelN
Temp. ClassificationAutomotive(E)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$7.46 $6.27 $5.59 $4.92 $4.64 $4.34
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
32
Package Dimensions
460 L x 1 H x 315 W (Mils)
Package Weight
246.64 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2340
Minimum Order Quantity (MOQ)
234
Order Increment
234
Estimated Lead Time (days)
315
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (7)

Feb 14, 2021
Transfer of Assembly Operations to Greatek Electronics Inc. for Select 32-Lead TSOP I Package Automotive Memory Products
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 08, 2020
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products.
Apr 14, 2020
Qualification of OSE-T as an Additional Assembly Site for Select Automotive Products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 24, 2017
Addendum to PCN 115091-TSOP 8 X 13.4 Tray Modification (Bottom Pocket Fence)

White Papers (1)

IBIS (1)

Sep 02, 2009

VHDL (1)

Sep 02, 2009