CY62128ELL-55ZAXE | Cypress Semiconductor

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CY62128ELL-55ZAXE
Status: In Production

Datasheet

(pdf, 907.93 KB) RoHS PB Free

CY62128ELL-55ZAXE

Development KitN/A
Automotive QualifiedY
Density (Kb)1024
Frequency (MHz)N/A
Max. Operating Temp. (°C)125
Max. Operating VCCQ (V)5.50
Max. Operating Voltage (V)5.50
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)4.50
Organization (X x Y)128K x 8
Speed (ns)55
Tape & ReelN
Temp. ClassificationAutomotive(E)

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$7.46 $6.27 $5.59 $4.92 $4.64 $4.34
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
32
Package Dimensions
460 L x 1 H x 315 W (Mils)
Package Weight
246.64 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2340
Minimum Order Quantity (MOQ)
234
Order Increment
234
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Application Notes (2)

Product Change Notice (PCN) (6)

May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 08, 2020
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products.
Apr 14, 2020
Qualification of OSE-T as an Additional Assembly Site for Select Automotive Products
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 24, 2017
Addendum to PCN 115091-TSOP 8 X 13.4 Tray Modification (Bottom Pocket Fence)

Advanced Product Change Notice (APCN) (5)

Nov 20, 2020
Q42020 Automotive Horizon Report Update
Jul 21, 2020
Q32020 Automotive Horizon Report Update
Apr 22, 2020
Q220 Automotive Horizon Report Update
Apr 14, 2020
Planned Qualification of New Assembly Sites for Select Automotive RAM Products
Apr 14, 2020
2020 Annual Automotive Horizon Update

Product Information Notice (PIN) (3)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Changes to Cypress Address Labels

White Papers (1)

IBIS (1)

Sep 02, 2009

VHDL (1)

Sep 02, 2009