CY62127DV30LL-55ZXIT | Cypress Semiconductor
CY62127DV30LL-55ZXIT
| Automotive Qualified | N |
| Density (Kb) | 1024 |
| Frequency (MHz) | N/A |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating VCCQ (V) | 3.60 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating VCCQ (V) | 2.20 |
| Min. Operating Voltage (V) | 2.20 |
| Organization (X x Y) | 64K x 16 |
| Speed (ns) | 55 |
| Tape & Reel | Y |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $2.75 | $2.31 | $2.06 | $1.81 | $1.71 | $1.60 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
Package
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Technical Documents
Application Notes (2)
Product Change Notice (PCN) (12)
Jun 19, 2019
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Qualification of KYOCERA KE-G3000DA Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
May 27, 2018
Qualification of Orient Semiconductor Electronics Ltd.- Taiwan (OSET) as an Additional Site for 44L TSOP 400mils Pb-Free Pacakge Qualification using Pure Sn Lead finish
May 27, 2018
Qualification of KYOCERA KE-G3000DA(For Non-SRAM Devices)/KE-G6000DA(For SRAM Devices) Green Mold Compound for 44lead TSOPII package for standard, Pb-Free and Green package application assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Product Information Notice (PIN) (2)
Oct 25, 2017
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).