CY24242OXC | Cypress Semiconductor

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CY24242OXC
Status: Obsolete

CY24242OXC

Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)2.5/3.3
Input Frequency Max. (MHz)14.31818
Input Frequency Min. (MHz)14.31818
Input Signal TypeXtal/Ref-in CMOS
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Outputs10
No. of PLL2
Output Frequency Max. (MHz)133.3
Output Frequency Min. (MHz)14.31818
Output Signal TypeCMOS
Spread SpectrumY
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$3.08 $2.59 $2.31 $2.03 $1.92 $1.79
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
28
Package Dimensions
408 L x 0 H x 210 W (Mils)
Package Weight
229.90 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
470
Minimum Order Quantity (MOQ)
470
Order Increment
470
Estimated Lead Time (days)
91
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn

Technical Documents

Product Change Notice (PCN) (12)

May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Conversion of Lead-Free Lead Finish in OSE Taiwan Assembly
May 28, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 8,14, 16, 20, 24 and 28 Lead 209mils SSOP Pb-Free packages assembled in OSE Taiwan and Amkor-Phil
May 27, 2018
Qualification of Cypress Manufacturing Limited (CML) as an alternative assembly site for 20 and 28 lead 209mils SSOP Pb-Free package
May 27, 2018
Change in Tube Bundling Ship Process
May 27, 2018
Shipping Label Upgrade
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Product Information Notice (PIN) (1)

Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

Nov 10, 2017
July 2014 Product Obsolescence Notification

IBIS (1)

Apr 03, 2012