CY23S09SXC-1 | Cypress Semiconductor

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CY23S09SXC-1
Status: Obsolete

Datasheet

(pdf, 270.86 KB) RoHS PB Free

CY23S09SXC-1

Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)133
Input Frequency Min. (MHz)10
Input Signal TypeLVCMOS/LVTTL
Max. Operating Temp. (°C)70
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)0
Min. Operating Voltage (V)3.00
No. of Outputs9
No. of PLL1
Output Frequency Max. (MHz)133
Output Frequency Min. (MHz)10
Output Signal TypeLVCMOS
Spread SpectrumY
Tape & ReelN
Temp. ClassificationCommercial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$7.57 $6.36 $5.68 $4.99 $4.71 $4.40
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
1440
Minimum Order Quantity (MOQ)
240
Order Increment
240
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Product Change Notice (PCN) (16)

May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 28, 2018
Qualification of Advanced Interconnect Technologies (AIT), as an alternate assembly site for 165 ball 13x15x1.4mm BGA Packages Using SnPb Solder Balls
May 27, 2018
Change in Tube Bundling Ship Process
May 27, 2018
Shipping Label Upgrade
May 27, 2018
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
May 27, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products
Oct 13, 2017
Standardization of Moisture Sensitivity Level (MSL) Classification for 8, 14 and 16 lead 150 mils SOIC Pb-free packages assembled at Orient Semiconductor Electronics, Tai

Advanced Product Change Notice (APCN) (6)

Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q419 Automotive Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update
Apr 14, 2020
Q319 Automotive Horizon Report Update
Apr 14, 2020
2019 Horizon Report: Q2 Update
Apr 14, 2020
2019 Automotive Horizon Report: Q2 Update

Product Information Notice (PIN) (1)

Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (1)

Apr 14, 2020
April 2019 Product Obsolescence Notification

IBIS (1)

Jan 06, 2010