CY2308SXC-4T | Cypress Semiconductor
CY2308SXC-4T
| Automotive Qualified | N |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 3.3 |
| Input Frequency Max. (MHz) | 133 |
| Input Frequency Min. (MHz) | 10 |
| Input Signal Type | LVCMOS/LVTTL |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.60 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.00 |
| No. of Outputs | 8 |
| No. of PLL | 1 |
| Output Frequency Max. (MHz) | 133 |
| Output Frequency Min. (MHz) | 10 |
| Output Signal Type | LVCMOS |
| Spread Spectrum | N |
| Tape & Reel | Y |
| Temp. Classification | Commercial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $8.27 | $6.96 | $6.20 | $5.45 | $5.15 | $4.81 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
16
Package Dimensions
390 L x 1.5 H x 150 W (Mils)
Package Weight
157.31 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
140
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Technical Documents
Product Change Notice (PCN) (15)
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Datasheet changes to the method of specification of IDDS and Duty Cycle in the Cypress Zero Delay Buffer (ZDB) products, CY2304, CY2305, CY2309 and CY2308
May 28, 2018
Qualification of TSMC as an alternate wafer fabrication site for the Zero Delay Buffer General Purpose Clocks Family
May 27, 2018
Additional Assembly Site qualified for NiPdAu Leadframe Pb-Free SOIC Packages
May 27, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14 and 16 Lead 150 mil SOIC Pb-free SOIC packages assembled in OSE Taiwan and Amkor-Phil
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
May 27, 2018
Standardization of Moisture Sensitivity Level (MSL) Classification for 8 and 16 lead 150 mils SOIC packages assembled at Cypress Manufacturing Limited (CML)
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Advanced Product Change Notice (APCN) (1)
May 27, 2018
Advance Notification - Transfer of Specific GP Clock Product Manufactured by Cypress Semiconductor Texas to Taiwan Semiconductor
Product Information Notice (PIN) (5)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines