CY22800KFXI | Cypress Semiconductor

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CY22800KFXI
Status: Obsolete

Datasheet

(pdf, 459.78 KB) RoHS PB Free

CY22800KFXI

Development KitCY36800
Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)3.3
Input Frequency Max. (MHz)100
Input Frequency Min. (MHz)0.5
Input Signal TypeXtal/Ref-in CMOS
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.47
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.14
No. of Outputs3
No. of PLL1
Output Frequency Max. (MHz)166
Output Frequency Min. (MHz)1
Output Signal TypeCMOS
Spread SpectrumY
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$6.56 $5.51 $4.92 $4.32 $4.08 $3.81
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
8
Package Dimensions
193 L x 1.5 H x 150 W (Mils)
Package Weight
76.45 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
2910
Minimum Order Quantity (MOQ)
485
Order Increment
485
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au

Technical Documents

Software and Drivers (1)

Oct 15, 2015

Product Change Notice (PCN) (8)

May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (2)

Aug 23, 2020
Q32020 Horizon Report Update
Apr 22, 2020
Q220 Standard Horizon Report Update

Product Information Notice (PIN) (4)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (3)

May 11, 2020
Addendum to PTN195105A - January 2020 Product Obsolescence Notification
Apr 14, 2020
Addendum to PTN195105 - January 2020 Product Obsolescence Notification
Apr 14, 2020
January 2020 Product Obsolescence Notification

IBIS (1)

Apr 24, 2012