CY22395FXIT | Cypress Semiconductor

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CY22395FXIT
Status: Obsolete

Datasheet

(pdf, 598.63 KB) RoHS PB Free
(pdf, 636.17 KB) RoHS PB Free

CY22395FXIT

Automotive QualifiedN
Core Voltage (V)3.3
I/O Voltage (V)2.5/3.3
Input Frequency Max. (MHz)150
Input Frequency Min. (MHz)1
Input Signal TypeXtal/Ref-in CMOS
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.45
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)3.13
No. of Outputs5
No. of PLL3
Output Frequency Max. (MHz)166
Output Frequency Min. (MHz)0
Output Signal TypeCMOS
Spread SpectrumN
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$12.76 $10.73 $9.57 $8.41 $7.95 $7.42
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
2500
Minimum Order Quantity (MOQ)
2500
Order Increment
2500
Estimated Lead Time (days)
182
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Product Change Notice (PCN) (10)

May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 29, 2018
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the CY2238x/ CY2239x, 3-PLL Clock Synthesizers
May 27, 2018
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Shipping Label Upgrade
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Advanced Product Change Notice (APCN) (1)

Apr 14, 2020
2020 Annual Horizon Report Update

Product Information Notice (PIN) (7)

Jun 10, 2020
Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Nov 07, 2017
Qualification of OSE as an additional Test and Finish Location for Cypress Products
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels

Product Termination Notice (PTN) (3)

May 11, 2020
Addendum to PTN195105A - January 2020 Product Obsolescence Notification
Apr 14, 2020
Addendum to PTN195105 - January 2020 Product Obsolescence Notification
Apr 14, 2020
January 2020 Product Obsolescence Notification

IBIS (1)

Jan 29, 2013