CY22393FXC | Cypress Semiconductor
CY22393FXC
| Automotive Qualified | N |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 3.3 |
| Input Frequency Max. (MHz) | 166 |
| Input Frequency Min. (MHz) | 1 |
| Input Signal Type | Xtal/Ref-in CMOS |
| Max. Operating Temp. (°C) | 70 |
| Max. Operating Voltage (V) | 3.45 |
| Min. Operating Temp. (°C) | 0 |
| Min. Operating Voltage (V) | 3.13 |
| No. of Outputs | 6 |
| No. of PLL | 3 |
| Output Frequency Max. (MHz) | 200 |
| Output Frequency Min. (MHz) | 0 |
| Output Signal Type | CMOS |
| Spread Spectrum | N |
| Tape & Reel | N |
| Temp. Classification | Commercial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $16.32 | $13.73 | $12.24 | $10.76 | $10.17 | $9.50 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
960
Minimum Order Quantity (MOQ)
960
Order Increment
960
Estimated Lead Time (days)
112
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au, Pure Sn
Marking
Package Material Declaration
Last Update: Nov 21, 2016
IPC 1752 Material Declaration
Last Update: Feb 05, 2020
Last Update: Feb 05, 2020
Package Qualification Report
Last Update: Aug 07, 2015
Device Qualification Reports
FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.
Last Update: Sep 21, 2016
Technical Documents
Product Change Notice (PCN) (14)
Jun 19, 2019
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 29, 2018
Qualification of Grace Semiconductor as an alternate wafer fabrication site for the CY2238x/ CY2239x, 3-PLL Clock Synthesizers
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
May 27, 2018
Standardization of Moisture Sensitive Level (MSL) Classification for 8, 14, 16, 20, 24 and 28 Lead 173mils TSSOP Pb-Free packages assembled in OSE Taiwan
May 27, 2018
Standardization of Moisture Sensitivity Level (MSL) Classification for 16, 24 and 28 lead TSSOP 173 mils packages assembled at Cypress Manufacturing Limited (CML)
May 27, 2018
Correction to Affected Devices in PCN#071577: Qualification of 0.9-mil Au wire diameter for CCD and MID devices assembled at CML
Oct 25, 2017
Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Product Information Notice (PIN) (4)
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation