CY22050KFZXI | Cypress Semiconductor
CY22050KFZXI
| Automotive Qualified | N |
| Core Voltage (V) | 3.3 |
| I/O Voltage (V) | 2.5/3.3 |
| Input Frequency Max. (MHz) | 133 |
| Input Frequency Min. (MHz) | 1 |
| Input Signal Type | Xtal/LVCMOS/LVTTL |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 3.45 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.13 |
| No. of Outputs | 6 |
| No. of PLL | 1 |
| Output Frequency Max. (MHz) | 166.6 |
| Output Frequency Min. (MHz) | 0.08 |
| Output Signal Type | CMOS |
| Spread Spectrum | N |
| Tape & Reel | N |
| Temp. Classification | Industrial |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| $10.74 | $9.03 | $8.05 | $7.08 | $6.69 | $6.25 |
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
16
Package Dimensions
200 L x 1 H x 173 W (Mils)
Package Weight
56.86 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
4800
Minimum Order Quantity (MOQ)
480
Order Increment
480
Estimated Lead Time (days)
63
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au
Marking
Package Material Declaration
Last Update: Nov 21, 2016
IPC 1752 Material Declaration
Last Update: Feb 05, 2020
Last Update: Feb 05, 2020
Technical Documents
Development Kits/Boards (1)
Software and Drivers (1)
Product Change Notice (PCN) (9)
Jan 11, 2021
Qualification of Greatek Electronics Inc. as an Alternate Assembly Site for Select 16-Lead TSSOP Package
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products.
May 28, 2018
Changes to Minimum Order Quantity (MOQ) and Order Increment (OI) values on various Cypress Products
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame Products at Amko Philippines andn Cypress Philippines and transfer of PDIP and PLCC parts from MMT to Amkor
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
GSMC Merger with HH-NEC to Form HHGrace Semiconductor Manufacturing Corporation