CY14B116N-Z45XI | Cypress Semiconductor

CY14B116N-Z45XI
Status: In Production

Datasheet

(pdf, 1.57 MB) RoHS PB Free
(pdf, 787.6 KB) RoHS PB Free
(pdf, 935.98 KB) RoHS PB Free

CY14B116N-Z45XI

Automotive QualifiedN
Density (Kb)16384
Frequency (MHz)N/A
InterfaceParallel
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.70
Min. Operating Voltage (V)2.70
Organization (X x Y)1Mb x 16
Part FamilyParallel nvSRAM
Speed (ns)45
Tape & ReelN
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$74.40 $66.00 $62.00 $58.00 $54.80 $51.20
Availability Quantity Ships In Buy from Cypress Buy from Distributors
In Stock 19 24-48 hours

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
472 L x 1.2 H x 787 W (Mils)
Package Weight
568.54 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
96
Minimum Order Quantity (MOQ)
96
Order Increment
96
Estimated Lead Time (days)
126
HTS Code
8542.32.0041
ECCN
(B.2.B.)
ECCN Suball
3A991.B.2.B

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Ni/Pd/Au

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (12)

Product Change Notice (PCN) (4)

Apr 14, 2020
Qualification of Nitto EM-760L2 Die Attach Film for 48-Lead, Pb-Free, TSOP I Packages Assembled at OSE-Taiwan
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 11, 2017
Qualification of PEAK Shipping Tray for 48-Lead TSOP I Products

Advanced Product Change Notice (APCN) (6)

Apr 22, 2020
Q220 Standard Horizon Report Update
Apr 14, 2020
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Apr 14, 2020
2020 Annual Horizon Report Update
Apr 14, 2020
Q419 Horizon Report Update
Apr 14, 2020
Q319 Horizon Report Update
Apr 14, 2020
2019 Horizon Report: Q2 Update

Product Information Notice (PIN) (2)

Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Manufacturing Label and Packing Configuration Standardization

IBIS (1)

Verilog (1)