CY14B108N-BA25XIT | Cypress Semiconductor

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CY14B108N-BA25XIT
Status: In Production

Datasheet

(pdf, 883.58 KB) RoHS PB Free
(pdf, 1015.85 KB) RoHS PB Free
(pdf, 799.15 KB) RoHS PB Free

CY14B108N-BA25XIT

Automotive QualifiedN
Density (Kb)8192
Frequency (MHz)N/A
InterfaceParallel
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating VCCQ (V)2.70
Min. Operating Voltage (V)2.70
Organization (X x Y)512Kb x 16
Part FamilyParallel nvSRAM
Speed (ns)25
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$81.32 $72.14 $67.77 $63.39 $59.90 $55.96
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
No. of Pins
48
Package Dimensions
393 L x 1.2 H x 236 W (Mils)
Package Weight
119.15 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
126
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Device Qualification Reports

FIT/MTBF, ESD (HBM/CDM) and Latch-up data available in the Device Qualification Report.

Technical Documents

Application Notes (10)

Product Change Notice (PCN) (5)

May 07, 2020
Qualification of BKK as an additional assembly site for select 48 & 121 ball grid array (BGA)
May 06, 2020
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
Nov 09, 2017
Planned Qualification of Spansion Manufacturing Sites for Cypress Products
Oct 25, 2017
Qualification of Die Attach Film for 48 Ball Grid Array (BGA) Stack Die Packages

Product Information Notice (PIN) (6)

Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Apr 14, 2020
Qualification of New Cover Tape (CPAK) for Tape and Reel Shipment at Cypress Philippines
Apr 14, 2020
Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Qualification of New Carrier Tape Supplier at Cypress Philippines
Nov 06, 2017
Changes to Cypress Address Labels
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families

Product Errata Notice (PEN) (1)

Nov 10, 2017
Errata for Autostore Disable Feature on 8 Mb nvSRAMDevices

Verilog (2)

VHDL (1)

Apr 19, 2010

IBIS (2)

Nov 30, 2009