CY14B108L-BA25XIT | Cypress Semiconductor

You are here

CY14B108L-BA25XIT
Status: In Production

Datasheet

(pdf, 883.58 KB) RoHS PB Free
(pdf, 1015.85 KB) RoHS PB Free
(pdf, 799.15 KB) RoHS PB Free

CY14B108L-BA25XIT

Automotive QualifiedN
Density (Kb)8192
Frequency (MHz)N/A
InterfaceParallel
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.70
Organization (X x Y)1Mb x 8
Part FamilyParallel nvSRAM
Speed (ns)25
Tape & ReelY
Temp. ClassificationIndustrial

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$62.55 $55.49 $52.13 $48.76 $46.07 $43.05
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
48
Package Dimensions
393 L x 1.2 H x 236 W (Mils)
Package Weight
119.15 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Standard Pack Quantity
2000
Minimum Order Quantity (MOQ)
2000
Order Increment
2000
Estimated Lead Time (days)
161
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991.B.2.A

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Technical Documents

Application Notes (10)

Product Change Notice (PCN) (4)

May 07, 2020
Qualification of BKK as an additional assembly site for select 48 & 121 ball grid array (BGA)
May 06, 2020
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
Oct 25, 2017
Qualification of Die Attach Film for 48 Ball Grid Array (BGA) Stack Die Packages

Verilog (1)

Mar 14, 2011

VHDL (1)

Apr 19, 2010

IBIS (1)

Nov 30, 2009