CY14B108K-ZS25XIT | Cypress Semiconductor

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CY14B108K-ZS25XIT
Status: In Production

Datasheet

(pdf, 1018.25 KB) RoHS PB Free
(pdf, 156.52 KB) RoHS PB Free
(pdf, 1.2 MB) RoHS PB Free

CY14B108K-ZS25XIT

AlarmsY
Automotive QualifiedN
Density (Kb)8192
Frequency (MHz)N/A
InterfaceParallel
Max. Operating Temp. (°C)85
Max. Operating VCCQ (V)3.60
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.70
Organization (X x Y)1Mb x 8
Part FamilyParallel nvSRAM
RTCY
Speed (ns)25
Tape & ReelY
Temp. ClassificationIndustrial
Watchdog TimerY

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$63.97 $56.74 $53.30 $49.87 $47.11 $44.02
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
SOP
No. of Pins
44
Package Dimensions
729 L x 1.1 H x 435 W (Mils)
Package Weight
453.25 (mgs)
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
1000
Minimum Order Quantity (MOQ)
1000
Order Increment
1000
Estimated Lead Time (days)
91
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Pure Sn

Technical Documents

Application Notes (10)

Product Change Notice (PCN) (11)

May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
May 06, 2020
Qualification of Die Attach Material and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSET
May 06, 2020
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
Apr 14, 2020
Addendum to PCN192401 - Qualification of Nitto EM-760 Die Attach Film and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSE-Taiwan
Apr 14, 2020
Qualification of Nitto EM-760 Die Attach Film and Die Thickness Change for 44-Lead TSOP II 2-Die Stack Package Assembled at OSE-Taiwan
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Oct 31, 2017
Q2, 2012 - Q4, 2013 Horizon Report
Oct 30, 2017
Q1, 2012 - Q2, 2013 Horizon Report
Oct 25, 2017
Qualification of Copper Palladium Wire Bonds for Select Lead Frame Products at JCET China
Oct 24, 2017
Qualification of Copper Wire Bonds for select Lead Frame (LF) Products

Verilog (1)

Mar 14, 2011

VHDL (1)

Apr 19, 2010

IBIS (1)

Nov 30, 2009