CY14B104LA-BA25XI | Cypress Semiconductor

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CY14B104LA-BA25XI
Status: In Production

Datasheet

(pdf, 910.24 KB) RoHS PB Free

CY14B104LA-BA25XI

Automotive QualifiedN
Max. Operating Temp. (°C)85
Max. Operating Voltage (V)3.60
Min. Operating Temp. (°C)-40
Min. Operating Voltage (V)2.70
Part FamilyParallel nvSRAM
Tape & ReelN

Pricing & Inventory Availability

1-9 unit Price* 10-24 unit Price* 25-99 unit Price* 100-249 unit Price* 250-999 unit Price* 1000+ unit Price*
$30.93 $27.44 $25.78 $24.11 $22.78 $21.29
Availability Quantity Ships In Buy from Cypress Buy from Distributors
Out of Stock 0 Please click here to check lead times

Packaging/Ordering

Package
BGA
No. of Pins
48
Package Dimensions
393 L x 1.2 H x 236 W (Mils)
Package Weight
119.15 (mgs)
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
2990
Minimum Order Quantity (MOQ)
299
Order Increment
299
Estimated Lead Time (days)
147
HTS Code
8542.32.0041
ECCN
(B.2.A.)
ECCN Suball
3A991

Quality and RoHS

Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu

Package Qualification Report

Technical Documents

Application Notes (10)

Product Change Notice (PCN) (5)

May 07, 2020
Qualification of BKK as an additional assembly site for select 48 & 121 ball grid array (BGA)
May 06, 2020
Qualification of Cypress’ Fab 25 as an Additional Wafer Fab Site and Cypress’ Test 25 as an Additional Wafer Sort Site for the 4Mb Parallel nvSRAM Product Family
Apr 14, 2020
Serial Number Addition to Top Mark for Select Flash and SRAM Parts at Cypress Bangkok
May 29, 2018
Qualification of Cypress Philippines as an Additional Assembly Site for select 48BGA products
Oct 24, 2017
Qualification of New Die Attach Epoxy and New Substrate Design for Select 48 Ball Grid Array (BGA) Packages

Verilog (1)

Mar 14, 2011

VHDL (1)

IBIS (1)