CY14B101KA-SP45XI | Cypress Semiconductor
CY14B101KA-SP45XI
Alarms | Y |
Automotive Qualified | N |
Density (Kb) | 1024 |
Frequency (MHz) | N/A |
Interface | Parallel |
Max. Operating Temp. (°C) | 85 |
Max. Operating VCCQ (V) | 3.60 |
Max. Operating Voltage (V) | 3.60 |
Min. Operating Temp. (°C) | -40 |
Min. Operating Voltage (V) | 2.70 |
Organization (X x Y) | 128Kb x 8 |
Part Family | Parallel nvSRAM |
RTC | Y |
Speed (ns) | 45 |
Tape & Reel | N |
Temp. Classification | Industrial |
Watchdog Timer | Y |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
$27.90 | $24.75 | $23.25 | $21.75 | $20.55 | $19.20 |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
Package
No. of Pins
48
Package Dimensions
625 L x 2.3 H x 295 W (Mils)
Package Weight
650.23 (mgs)
Package Cross Section Drawing
Package Carrier
TUBE
Package Carrier Drawing / Orientation
Standard Pack Quantity
600
Minimum Order Quantity (MOQ)
60
Order Increment
60
Estimated Lead Time (days)
182
HTS Code
8542.32.0041
ECCN
None
ECCN Suball
EAR99
Quality and RoHS
Moisture Sensitivity Level (MSL)
3
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Pure Sn;Ni/Pd/Au
Marking
IPC 1752 Material Declaration
Technical Documents
Application Notes (10)
Feb 18, 2018
Product Change Notice (PCN) (9)
Nov 11, 2020
Transfer of Assembly Operations to Greatek Electronics Inc. for Select 48-Lead SSOP Package
May 10, 2020
Addendum 2 Change in Qualification of Copper Wire Bonds for 56SSOP Products at OSE-Taiwan
May 08, 2020
Notice of plan to transfer package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET).
May 06, 2020
Change in Qualification of Copper Wire Bonds for select Lead Frame Products at OSE-Taiwan
Apr 14, 2020
Qualification of Fab 25 as an Additional Wafer Fab Site and Test 25 as an Additional Wafer Sort Site for 3V/5V 1Mb Parallel nvSRAM Products
May 28, 2018
Transfer of package manufacturing from Cypress Philippines to Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) for select products
Advanced Product Change Notice (APCN) (4)
Apr 14, 2020
Planned Qualification of New Assembly, Test, and Finish Sites for Select RAM Products
Product Information Notice (PIN) (5)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization
Nov 06, 2017
Addendum to PIN 135258 - Qualification of JCET as an additional Test and Finish Location for Cypress Products
Nov 06, 2017
Improvement of Cypress Minnesota Back-End-of-Line Integration for 130nm SONOS Product Families