BCM89071A1CUBXGT | Cypress Semiconductor
BCM89071A1CUBXGT
| Automotive Grade | Automotive Grade 3 |
| Automotive Qualified | Y |
| Bluetooth Power Class | Class 1, Class 2, Class 3 |
| Bluetooth Specification | Bluetooth 4.1 |
| CPU Core | ARM7TDMI-S |
| Co-existence Interface | GCI SECI |
| Device Type | Silicon |
| FM Transceiver (TX/RX) | N |
| Interfaces | UART,I2C,SPI, I2S/PCM |
| MIMO/SISO | N/A |
| Max. Operating Frequency (MHz) | 48 |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 5.50 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 2.30 |
| No. of GPIOs | 8 |
| Partner Modules | N |
| Product Family | BCM89071 |
| RAM (KB) | 112 |
| Silicon Features | Integrated Regulator, HCI-over-UART/SPI |
| Tape & Reel | Y |
| Wi-Fi Band | N/A |
| Wi-Fi PHY Data Rate (Mbps) | N/A |
| Wireless Technology | Bluetooth (BR + EDR) |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| Contact Sales | |||||
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
42
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
5000
Minimum Order Quantity (MOQ)
5000
Order Increment
5000
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
5A992.C
Quality and RoHS
Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Technical Documents
Application Notes (7)
Jun 02, 2020
Product Change Notice (PCN) (1)
Oct 11, 2017
Removal of Broadcom Logo and Transition to Cypress Part Number for Automotive IoT Products
Advanced Product Change Notice (APCN) (2)
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization