BCM88335L2CUBGT | Cypress Semiconductor
BCM88335L2CUBGT
| Automotive Grade | Automotive Grade 3 |
| Automotive Qualified | N |
| Bluetooth Power Class | Class 1, Class 2 |
| Bluetooth Specification | Bluetooth 4.1 |
| Co-existence Interface | Integrated Wi-Fi and Bluetooth Coexistence, GCI SECI for external radios |
| Device Type | Silicon |
| Driver Support | Linux |
| FM Transceiver (TX/RX) | N |
| Interfaces | SDIO 3.0/2.0, gSPI for Wi-Fi and I2C/PCM audio, HCI-over UART for Bluetooth |
| MIMO/SISO | 1x1 SISO |
| Max. Operating Temp. (°C) | 85 |
| Max. Operating Voltage (V) | 4.80 |
| Min. Operating Temp. (°C) | -40 |
| Min. Operating Voltage (V) | 3.00 |
| Module Features | N/A |
| No. of GPIOs | 9 |
| Partner Modules | N |
| Product Family | BCM88335 |
| Security and Encryption | WPA/WPA2. WAPI STA Network Security, AES encryption/decryption with TKIP and IEEE 802.1x support, Cisco Extension Support, WPS |
| Silicon Features | Integrated PA, PMU with Buck-Mode Switching Regulator, Shared Bluetooth and Wi-Fi Antenna Support |
| Tape & Reel | Y |
| Wi-Fi Band | Dual Band (2.4/5Ghz) |
| Wi-Fi PHY Data Rate (Mbps) | upto 433Mbps |
| Wireless Technology | Wi-Fi, Bluetooth (BR + EDR + BLE) |
Pricing & Inventory Availability
| 1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
|---|---|---|---|---|---|
| Contact Sales | |||||
| Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
|---|---|---|---|---|
| Out of Stock | 0 | Please click here to check lead times | Contact Sales | Contact Sales |
Packaging/Ordering
No. of Pins
145
Package Cross Section Drawing
Package Carrier
REEL
Package Carrier Drawing / Orientation
Standard Pack Quantity
5000
Minimum Order Quantity (MOQ)
5000
Order Increment
5000
Estimated Lead Time (days)
210
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
5A992.C
Quality and RoHS
Moisture Sensitivity Level (MSL)
1
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu;Sn/Ag
Marking
Technical Documents
Application Notes (7)
Jun 02, 2020
Product Change Notice (PCN) (3)
Nov 25, 2020
Addendum to PCN200902 - Qualification of PTI-SG as an Additional Bumping, Wafer Sort, Backend and Finish Site for Select WLCSP Products
Apr 14, 2020
Qualification of PTI-SG as an Additional Bumping, Wafer Sort, Backend and Finish Site for Select WLCSP Products
Oct 11, 2017
Removal of Broadcom Logo and Transition to Cypress Part Number for Automotive IoT Products
Advanced Product Change Notice (APCN) (7)
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization