BCM20713A1KUFBXG | Cypress Semiconductor
BCM20713A1KUFBXG
Automotive Grade | Automotive Grade 3 |
Automotive Qualified | N |
Bluetooth Power Class | Class 1, Class 2, Class 3 |
Bluetooth Specification | Bluetooth 4.0 |
CPU Core | ARM7TDMI-S |
Co-existence Interface | Legacy SECI |
Device Type | Silicon |
FM Transceiver (TX/RX) | N |
Interfaces | UART,I2C,SPI, I2S/PCM |
MIMO/SISO | N/A |
Max. Operating Frequency (MHz) | 48 |
Max. Operating Temp. (°C) | 85 |
Max. Operating Voltage (V) | 3.60 |
Min. Operating Temp. (°C) | -30 |
Min. Operating Voltage (V) | 1.40 |
No. of GPIOs | 8 |
Partner Modules | N |
Product Family | BCM20713 |
RAM (KB) | 112 |
Silicon Features | Integrated Regulator, HCI-over-UART/SPI |
Tape & Reel | N |
Wi-Fi Band | N/A |
Wi-Fi PHY Data Rate (Mbps) | N/A |
Wireless Technology | Bluetooth (BR + EDR) |
Pricing & Inventory Availability
1-9 unit Price* | 10-24 unit Price* | 25-99 unit Price* | 100-249 unit Price* | 250-999 unit Price* | 1000+ unit Price* |
---|---|---|---|---|---|
Contact Sales |
Availability | Quantity | Ships In | Buy from Cypress | Buy from Distributors |
---|---|---|---|---|
Out of Stock | 0 | Please click here to check lead times | Contact Sales | Buy |
Packaging/Ordering
No. of Pins
50
Package Cross Section Drawing
Package Carrier
TRAY
Package Carrier Drawing / Orientation
Standard Pack Quantity
3430
Minimum Order Quantity (MOQ)
490
Order Increment
490
Estimated Lead Time (days)
126
HTS Code
8542.31.0001
ECCN
None
ECCN Suball
5A992.C
Quality and RoHS
Moisture Sensitivity Level (MSL)
Peak Reflow Temp. (°C)
260 (Cypress Reflow Profile)
RoHS Compliant
Y
PB Free
Y
Lead/Ball Finish
Sn/Ag/Cu
Marking
Technical Documents
Application Notes (7)
Mar 03, 2021
Product Change Notice (PCN) (2)
Oct 11, 2017
Transition from Broadcom Marketing Part Numbers to Cypress Marketing Part Numbers
Oct 11, 2017
Qualification of STATS ChipPAC Jiangyin (JSCC) as an Additional Assembly Site for Select BGA Products
Product Information Notice (PIN) (4)
Apr 14, 2020
Addendum to PIN195102 - Manufacturing Label and Packing Configuration Standardization