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Packaging | Cypress Semiconductor

Package Description Name
IPC1752 MATERIAL DECLARATION FBGA165 (13X15 mm) (BW165)_ASEK_Cu WIRE_SnAgCu(SAC405)_HITACHI ATB125_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION TFBGA48 (6X10 mm) (BA48)_ASEK_ CuPd WIRE_SnPb_HENKEL 2025D_KYOCERA KEG G2270
IPC1752 MATERIAL DECLARATION TFBGA48 (6X10 mm) (BA48)_ASEK_Au WIRE_SnPb_HENKEL 8355F_COOKSON SMT B
IPC1752 MATERIAL DECLARATION TFBGA48 (6X10 mm) (BA48) ASEK_Au WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA 256 (17 x17 mm) (BB256)_ASET_SnPb_CuPd Wire
IPC1752 MATERIAL DECLARATION FBGA256 (17 X17 mm) (BB256)_ASEK_Au WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION BGA60 (5.5X5.5X0.6 mm) (BU60)_ASEC_CuPd WIRE_SnAgCu(SAC105)_HENKEL ATB125_KYOCERA KEG1250
IPC1752 MATERIAL DECLARATION BGA60 (5.5X5.5X0.6 mm) (BU60)_ASEC_Au WIRE_SnAgCu(SAC105)_HENKEL ATB125_KYOCERA KEG1250
IPC1752 MATERIAL DECLARATION BGA60 (5.5X5.5X0.6 mm) (BU60)_ASEK_Au WIRE_SnAgCu(SAC105)_HENKEL ATB125_KYCOERA KEG1250
IPC1752 MATERIAL DECLARATION BGA165 (15X17 mm) (BW165)_BKK_CuPd WIRE_SnAgCu(SAC405)_HITACHI HR9050G_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION BGA165 (15X17 mm) (BW165)_ASEK_CuPd WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION VFBGA36 (6X8 mm) (BV36)_BKK_CuPd WIRE_SnPb_SUMITOMO CRM1577DB_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION VFBGA36 (6X8 mm) (BV36)_ASEK_CuPd WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION 36 VFBGA (6X8 mm) (BV36)_ASEK_Au WIRE_SnPb_HENKEL 2025D_KYOCERA KG2250
IPC1752 MATERIAL DECLARATION BGA48 (6X8 mm) (BZ48)_BKK_CuPd WIRE_SnAgCu(SAC105)_HENKEL QMI546_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION BGA48 (6X8 mm) (BZ48)_ASEK_Au WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION BGA48 (6X8 mm) (BZ48)_ ASEK_CuPd WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA209 (14X22X1.76 mm) (BW209)_ASEK_CuPd WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA209 (14X22X1.76 mm) (BW209)_ASEK_Cu WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION BGA24 (6X8 mm) (ZSA24)_BKK_CuPd WIRE_SnAgCu(SAC305)_HITACHI HR9070G_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION UFBGA48 (4.3X4.3X0.6 mm) (BU48)_ASEK_CuPd WIRE_SnAgCu(SAC105)_HENKEL ATB125_KYOCERA KEG1250
IPC1752 MATERIAL DECLARATION FBGA196 (15X15X1.5 MM) (BW196)_ASEK_CuPd WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA196 (15X15 X1.5 MM) (BW196)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION FBGA172 (15X15X1.6 mm) (BW172)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION TFBGA 48 (7 X 7 mm) (BK/BP48)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION 36 BGA (7X7 MM) (BK/BP36) ASET SnAgCu CuPd Wire
IPC1752 MATERIAL DECLARATION BGA 48 (6 x 10 x 1.2mm) (BK/FCE 48)_Cypress Bangkok_SnAgCu_CuPd Wire
IPC1752 MATERIAL DECLARATION BGA 48 (6 x 10 x 1.2mm) (BK/FCE 48)_ASET_SnAgCu_Au Wire_Automotive Device
IPC1752 MATERIAL DECLARATION BGA 48 (6 x 10 x 1.2mm) (BK/FCE 48)_ASET_SnAgCu_CuPd Wire
IPC1752 MATERIAL DECLARATION 47ball - Flip-chip BGA (9.9 X 9.9 X 1.25 mm) (FR47) - ASET
IPC1752 MATERIAL DECLARATION FBGA48 (8X20 mm) (BK48)_ASEK_Au WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION 48- BGA (8.15 x 6.15 mm) (VBK48) BKK CUPD WIRE
IPC1752 MATERIAL DECLARATION BGA 256 (27 x27 mm) (BJ256)_ASET_SnAgCu_Au Wire_EN4900
IPC1752 MATERIAL DECLARATION FBGA 256 (17 x 17 mm) (BW256)_ASET_SnAgCu_Cu Wire
IPC1752 MATERIAL DECLARATION BGA 24 (8.0 X 6.0 X 1.0 MM) (ELA024)_Cypress Bangkok_SnAgCu_Au Wire
IPC1752 MATERIAL DECLARATION VFBGA 36 (6X8 mm) (BZ36)_BKK_CuPd Wire_SnAgCu(SAC105)_HENKEL QMI546_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION VFBGA36 (6X8 mm) (BZ36)_ASEK_CuPd WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION PDIP 28L (300 MILs) (PZ28)_Amkor Phils _Pure Sn_Cu WIRE
IPC 1752 Material Declaration BGA121(10x10x1.2 mm) BK121 Cypress Bangkok (SB) CuPdAu Bond Wire Material
IPC 1752 Material Declaration BGA121(10x10x1.2 mm) BK121 Cypress Bangkok (SB) Au Bond Wire Material
IPC 1752 Material Declaration BGA121(10x10x1.2 mm) BK121 Cypress Bangkok (SB) CuPd Bond Wire Material
IPC 1752 Material Declaration BGA121(10x10x1.2 mm) BK121 ASE Taiwan Au Bond Wire Material
IPC 1752 Material Declaration BGA121(10x10x1.2 mm) BK121 ASE Taiwan CuPd Bond Wire Material
IPC1752 MATERIAL DECLARATION BGA 121 (10x10x1.7mm) (BK121)_ASET _SnAgCu_Au WIRE
IPC1752 MATERIAL DECLARATION 32L SOJ (300 MILS) (VZ32) - JCET PURE SN CUPD WIRE
IPC1752 MATERIAL DECLARATION 32L SOJ (400 MILS) (VZ32) - JCET PURE SN CUPD WIRE
IPC1752 MATERIAL DECLARATION 32L SOJ (400 MILS) (VZ32) - JCET NIPDAU AU WIRE
IPC 1752 Material Declaration PQFP52L (10x10 mm) NZ52L Amkor Phils (P1_P2)
IPC 1752 Material Declaration PBGA119 (14x22 mm) BG119 ASE Taiwan Ablestik 8551F
IPC1752 MATERIAL DECLARATION CLCC 6L (5x7x1.8 mm) (LZ6)_ECERA-ER _Au WIRE

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