You are here

Packaging | Cypress Semiconductor

Package Description Name
IPC1752 MATERIAL DECLARATION VFBGA36 (6X8 mm) (BV36)_ASEK_CuPd WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION BGA48 (6X8 mm) (BZ48)_BKK_CuPd WIRE_SnAgCu(SAC105)_SUMITOMO CRM-1577DB _SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION BGA48 (6X8 mm) (BZ48)_ASEK_Au WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION BGA48 (6X8 mm) (BZ48)_ ASEK_CuPd WIRE_SnAgCu(SAC105)_HENKEL 2100A_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA209 (14X22X1.76 mm) (BW209)_ASEK_CuPd WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA209 (14X22X1.76 mm) (BW209)_ASEK_Cu WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION BGA24 (6X8 mm) (ZSA24)_BKK_CuPd WIRE_SnAgCu(SAC305)_HITACHI HR9070G_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION UFBGA48 (4.3X4.3X0.6 mm) (BU48)_ASEK_CuPd WIRE_SnAgCu(SAC105)_HENKEL ATB125_KYOCERA KEG1250
IPC1752 MATERIAL DECLARATION FBGA196 (15X15X1.5 MM) (BW196)_ASEK_CuPd WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA196 (15X15 X1.5 MM) (BW196)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION FBGA172 (15X15X1.6 mm) (BW172)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION TFBGA 48 (7 X 7 mm) (BK/BP48)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION 36 BGA (7X7 MM) (BK/BP36) ASET SnAgCu CuPd Wire
IPC1752 MATERIAL DECLARATION BGA 48 (6 x 10 x 1.2mm) (BK/FCE 48)_Cypress Bangkok_SnAgCu_CuPd Wire
IPC1752 MATERIAL DECLARATION BGA 48 (6 x 10 x 1.2mm) (BK/FCE 48)_ASET_SnAgCu_Au Wire_Automotive Device
IPC1752 MATERIAL DECLARATION BGA 48 (6 x 10 x 1.2mm) (BK/FCE 48)_ASET_SnAgCu_CuPd Wire
IPC1752 MATERIAL DECLARATION 47ball - Flip-chip BGA (9.9 X 9.9 X 1.25 mm) (FR47) - ASET
IPC1752 MATERIAL DECLARATION FBGA48 (8X20 mm) (BK48)_ASEK_Au WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION 48- BGA (8.15 x 6.15 mm) (VBK48) BKK CUPD WIRE
IPC1752 MATERIAL DECLARATION BGA 256 (27 x27 mm) (BJ256)_ASET_SnAgCu_Au Wire_EN4900
IPC1752 MATERIAL DECLARATION BGA 24 (8.0 X 6.0 X 1.0 MM) (ELA024)_Cypress Bangkok_SnAgCu_Au Wire
IPC1752 MATERIAL DECLARATION VFBGA 36 (6X8 mm) (BZ36)_BKK_CuPd Wire_SnAgCu(SAC105)_HENKEL QMI546_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION VFBGA36 (6X8 mm) (BZ36)_ASEK_CuPd WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2270
IPC 1752 Material Declaration BGA121(10x10x1.2 mm) BK121 Cypress Bangkok (SB) CuPdAu Bond Wire Material
IPC 1752 Material Declaration BGA121(10x10x1.2 mm) BK121 Cypress Bangkok (SB) Au Bond Wire Material
IPC 1752 Material Declaration BGA121(10x10x1.2 mm) BK121 Cypress Bangkok (SB) CuPd Bond Wire Material
IPC 1752 Material Declaration BGA121(10x10x1.2 mm) BK121 ASE Taiwan Au Bond Wire Material
IPC1752 MATERIAL DECLARATION BGA121(10X10X1.2 mm) (BK121)_ASEK_CuPd WIRE_SnAgCu(SAC105)_HENKEL 2100_KYOCERA G2250
IPC1752 MATERIAL DECLARATION BGA 121 (10x10x1.7mm) (BK121)_ASET _SnAgCu_Au WIRE
IPC1752 MATERIAL DECLARATION 32L SOJ (300 MILS) (VZ32) - JCET PURE SN CUPD WIRE
IPC1752 MATERIAL DECLARATION 32L SOJ (400 MILS) (VZ32) - JCET PURE SN CUPD WIRE
IPC1752 MATERIAL DECLARATION 32L SOJ (400 MILS) (VZ32) - JCET NIPDAU AU WIRE
IPC1752 MATERIAL DECLARATION CLCC 6L (5x7x1.8 mm) (LZ6)_ECERA-ER _Au WIRE
IPC1752 MATERIAL DECLARATION VFBGA100 (6X6X1.0 mm) (BZ100)_BKK_Au WIRE_SnAgCu(SAC105)_HENKEL QMI546_SHINETSU KMC 3580LVA
IPC1752 MATERIAL DECLARATION VFBGA100 (6X6X1.0 MM) (BZ100)_ASEK_CUPD WIRE_SNAGCU(SAC105)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION VFBGA100 (6X6X1.0 mm) (BZ100)_ASEK_Cu WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION VFBGA100 (6X6X1.0 mm) (BZ100)_ASEK_Au WIRE_SnAgCu(SAC105)_HITACHI FH900_SHINETSU KEG2270
16L-SOIC (10.3 x 7.5 x 2.65MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET 16L-SOIC (10.3 x 7.5 x 2.65MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
IPC1752 MATERIAL DECLARATION 28L SOJ (300 MILS) (VZ28) - JCET PURE SN CUPD WIRE
IPC 1752 Material Declaration FBGA60 (8x20x1.2 mm) BA60 ASE Taiwan Gold Wire Material
IPC1752 MATERIAL DECLARATION PDIP18 (300 mil) (PZ18)_AMKOR PHIL_Cu WIRE_PURE Sn_HENKEL 8361J_SUMITOMO G600
IPC1752 MATERIAL DECLARATION PDIP 8L (300 mil) (PZ08)_AMKOR PHIL_Cu WIRE_PURE Sn_HENKEL 8361J_SUMITOMO G600
IPC 1752 Material Declaration FBGA209 (14x22x1.76 mm) BB 209 ASE Taiwan
IPC 1752 Material Declaration FBGA196 (15x15x1.5 mm) BB196 ASE Taiwan Copper Palladium Wire
IPC1752 MATERIAL DECLARATION PLCC 28L (450x450 mil) (JZ28)_Amkor Philippines _Pure Sn_Cu Wire
IPC1752 MATERIAL DECLARATION LCC 4L (5 x 3.2 mm) (LZ4)_ECERA Taiwan_Au WIRE
IPC 1752 Material Declaration FBGA209 (14x22x1.76 mm) BW209 ASE Taiwan 209 Side By Side Stacked (2) Die FBGA
IPC1752 MATERIAL DECLARATION FBGA209 STACKED DIE (14X22X1.76 mm) (BW209)_ASEK_Au WIRE_SnAgCu(SAC405)_HENKEL ATB125_KYOCERA KEG2250
IPC 1752 Material Declaration QSOP24L (150 mils) SQ24L JCET Copper Wire
IPC 1752 Material Declaration DFN18L (4x4.5x0.8 mm) LH8L UTAC (UTL Bangkok)

Pages