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Packaging | Cypress Semiconductor

Package Description Name
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product. IPC1752 MATERIAL DECLARATION SOIC16 STACKED DIE (300 mil) (SS16)_ZKT_PURE Sn_CuPd WIRE_YIZBOND 8511/LINTEC LE62_SAMSUNG SG8300HKT
IPC1752 MATERIAL DECLARATION QFN56 (8X8X1. mm) (LT56)_ASEK_Cu WIRE_PURE Sn_HITACHI EN4900F_SUMITOMO G631H
IPC1752 MATERIAL DECLARATION TSOPII 44 (400 mil) (ZW44)_CML_Cu WIRE_NiPdAu_HENKEL QMI509 _KYOCERA G6000DA
IPC1752 MATERIAL DECLARATION TSSOP16 (173 mil) (ZZ16)_CML_Cu WIRE_NiPdAu_ HENKEL QMI509_KYOCERA KEG3000DA
IPC1752 MATERIAL DECLARATION TQFP 64 (14 X 14 mm) (AZ64)_ASEK_Cu WIRE_PURE Sn_HITACHI CRM1076W_SUMITOMO G631H
IPC1752 MATERIAL DECLARATION QFN68 (8X8X1.0 mm) (LT68)_ASEK_Cu WIRE_PURE Sn_HITACHI EN4900F_SUMITOMO G631H
IPC1752 MATERIAL DECLARATION TQFP44 (10X10X1.4 mm) (AZ44)_JCET CHINA_CuPd WIRE_PURE Sn_HENKEL QMI509_SUMITOMO G20B
IPC1752 MATERIAL DECLARATION TQFP100 (14X14X1.4 mm) (AZ100)_ASEK_CuPd WIRE_PURE Sn_HITACHI FH900_SUMITOMO G631H
IPC1752 MATERIAL DECLARATION WLCSP72 (4.25X4.98X0.60 mm) (FN72)_DECATECH_SnAgCu(SAC405)
IPC1752 MATERIAL DECLARATION DFN8 (5X6X0.75 mm)_(LH08)_UTAC THAILAND_CuPd WIRE_PURE Sn_HENKEL 8600_SUMITOMO EMEG770HCD
IPC1752 MATERIAL DECLARATION WLCSP194 (4.97X7.50X0.55 mm) (FN194)_ ASEK_SnAgBiCu
IPC1752 MATERIAL DECLARATION BGA24 (VAA24) (6X8X1 mm)_BKK_Au WIRE_PURE Sn_HENKEL QMI546_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION SOJ44 (400 mil) (VZ44)_JCET CHINA_CuPd WIRE_PURE Sn_HENKEL QMI509_SUMITOMO G620B
IPC1752 MATERIAL DECLARATION FBGA165 (13X15 mm) (BB165)_BKK_CuPd WIRE_SnPb_HITACHI HR9050G_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION FBGA165 (13X15 mm) (BB165)_ASEK_CuPd WIRE_SnPb_HENKEL ATB125_KYOCERA G2250
IPC1752 MATERIAL DECLARATION FBGA165 (13X15 mm) (BB165)_ASEK_SnPb_Cu WIRE_HITACHI ATB125_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA165 (13X15 mm) (BB165)_ASEK_Au WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA165 (15X17 mm) (BB165)_ASEK_CuPd WIRE_SnPb_HENKEL ATB125_ KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA165 (15X17 mm) (BB165)_ASEK_Au WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION TSOPI 32 (8 X 13.4 MM) (ZB32)_ASET_Au WRE_PURE Sn_ SUMITOMO CRM1076WA_SUMITOMO G631H
IPC1752 MATERIAL DECLARATION BGA24 (E2A024)_BKK_Au WIRE_HENKEL QMI546_SHINETSU KMC 3580LVA
IPC1752 MATERIAL DECLARATION WLCSP49 (FR49) (4.5X4 mm)_SPIL_SnAgCu(SAC105)_PANASONIC CV8710TAC
IPC1752 MATERIAL DECLARATION VFBGA124 ((9X9X1.0 mm) (BZ124)_ASEK_CuPd WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG1250
IPC1752 MATERIAL DECLARATION VFBGA48 (6X8 mm) (BV48)_BKK_CuPd WIRE_SnPb_SUMITOMO CRM1577DB_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION VFBGA48 (6X8 mm) (BV48)_ASEK_CuPd WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION WLCSP42 (2.63X3.18X0.55 mm) (FN42A)_DECATECH_SnAgCu(SAC405)
IPC1752 MATERIAL DECLARATION VFBGA48 (8X9.5 mm) (BV48)_ASEK_Cu WIRE_SnPb_HENKEL 2025D_KYOCER KEG2270
IPC1752 MATERIAL DECLARATION TFBGA48 (8X9.5 mm) (BA48)_ASEK_Au WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION TFBGA48 (7X8.5 mm) (BA48)_ASEK_Au WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2270
IPC1752 MATERIAL DECLARATION TFBGA48 (8X20 mm) (BA48)_ASET_Au WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2270
IPC-1752-2_V1.1_361L FLIP CHIP BGA (21 X 21 X 2.5 MM)_ASE TAIWAN
IPC1752 MATERIAL DECLARATION PBGA272 (27X27 mm) (BG272)_ASEK_Au WIRE_SnPb_HENKEL 2100A_SUMITOMO EMEG770J
IPC1752 MATERIAL DECLARATION FBGA 36 (7X8.5X1.2MM) (BA36)_ASET_SnPb_CuPd Wire Non Pb-free
IPC1752 MATERIAL DECLARATION FBGA96 (6X6X1.0 mm) (BZ/R2A96)_BKK_Au WIRE_SnAgCu(SAC305)_HITACHI CHEMICAL HR5104_HENKEL QMI546_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION 48-TFBGA (8 X 10 MM) (BA48)_ASEK_SnPb_Au WIRE_HENKEL 2025D_KYOCERA 2270:
IPC1752 MATERIAL DECLARATION FBGA48 (8X9. X1.0 mm) (BZ48)_ASEK_CuPd WIRE_SnAgCu(SAC405)_HENKEL ATB125_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA48 (8X9.5X1.0 mm) (BZ48)_ASEK_Cu WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION BGA56 (5X5 mm) (BZ56)_ASEK_CuPd WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA165 (13X15 mm) (BW165)_BKK_CuPd WIRE_SnAgCu(SAC405)_HITACHI HR9050G_SHINETSU KMC-3580LVA
IPC1752 MATERIAL DECLARATION FBGA165 (13 X 15 mm) (BW165)_ASEK_Au WIRE_SnAgCu(SAC105)_HENKEL ATB125_KYOCERA KEG1250LKDS
IPC1752 MATERIAL DECLARATION FBGA165 (13X15 mm) (BW165)_ASEK_CuPd WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION TFBGA48 (6X10 mm) (BA48)_ASEK_ CuPd WIRE_SnPb_HENKEL 2025D_KYOCERA KEG G2270
IPC1752 MATERIAL DECLARATION TFBGA48 (6X10 mm) (BA48) ASEK_Au WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FBGA 256 (17 x17 mm) (BB256)_ASET_SnPb_CuPd Wire
IPC1752 MATERIAL DECLARATION BGA60 (5.5X5.5X0.6 mm) (BU60)_ASEC_CuPd WIRE_SnAgCu(SAC105)_HENKEL ATB125_KYOCERA KEG1250
IPC1752 MATERIAL DECLARATION BGA60 (5.5X5.5X0.6 mm) (BU60)_ASEC_Au WIRE_SnAgCu(SAC105)_HENKEL ATB125_KYOCERA KEG1250
IPC1752 MATERIAL DECLARATION BGA60 (5.5X5.5X0.6 mm) (BU60)_ASEK_Au WIRE_SnAgCu(SAC105)_HENKEL ATB125_KYCOERA KEG1250
IPC1752 MATERIAL DECLARATION BGA165 (15X17 mm) (BW165)_BKK_CuPd WIRE_SnAgCu(SAC405)_HITACHI HR9050G_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION BGA165 (15X17 mm) (BW165)_ASEK_CuPd WIRE_SnAgCu(SAC405)_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION VFBGA36 (6X8 mm) (BV36)_BKK_CuPd WIRE_SnPb_SUMITOMO CRM1577DB_SHINETSU KMC3580LVA

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