You are here

Packaging | Cypress Semiconductor

Package Description Name
IPC1752 MATERIAL DECLARATION SSOP28 (209 mil) (SP28)_CML_Au WIRE_NiPdAuAg_HENKEL QI509_KYOCERA KEG3000
IPC1752 MATERIAL DECLARATION TQFP64 (10X10 mm) (AY64)_ASEK_CuPd WIRE_PURE Sn_HITACHI FH900_SUMITOMO EMEG631H
IPC1752 MATERIAL DECLARATION FBGA48 (6 X 8 mm) (BZ48)_ASEK_Cu WIRE_SnAgCu(SAC105)_HENKEL 2025D_KYOCERA G2250
IPC1752 MATERIAL DECLARATION BGA48 (6X8 mm) (BK48)_ASEK_Au WIRE_SnAgCu(SAC105)_HENKEL 2100_KYOCERA G2250
IPC1752 MATERIAL DECLARATION SOIC8 (150 mil) (SW815)_UTAC THAILAND_CuPd WIRE_PURE Sn_HENKEL 8200T_SUMITOMOT G600
IPC1752 MATERIAL DECLARATION FBGA48 (6X8 mm) (BZ48)_BKK_Au WIRE_SnAgCu(SAC105)_HENKEL QMI546_KINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION TSOPI 48 (12X18.4 mm) (ZT/TS/ZN48)_OSET_CuPd WIRE_PURE Sn_SUMITOMO EM760_HITACHI CEL9200HFU
IPC1752 MATERIAL DECLARATION TQFP32 (7X7X1.4 mm) (AZ32)_ASEK_CuPd WIRE_PURE Sn_SUMITOMO CRM1076WA_SUMITOMO EME6631H
IPC1752 MATERIAL DECLARATION PDIP18 (300 mil) (PZ18)_CML_Cu WIRE_NiPdAu_HENKEL QMI509_NITTO MP8500
IPC1752 MATERIAL DECLARATION TQFP64 (14X14 mm) (AZ64)_ASEK_CuPdAu WIRE_PURE Sn_HITACHI FH900_SUMITOMO EMEG631H
IPC1752 MATERIAL DECLARATION TQFP64 (14 X 14 mm) (AZ64)_CML_CuPd WIRE_NiPdAu_HENKEL QMI509_KYOCERA KEG3000DA
IPC1752 MATERIAL DECLARATION TSOPI 28 (8X13.4 mm) (ZT28R)_OSET_Au WIRE_PURE Sn_SUMITOMO CRM1076_SUMITOMO EMEG631SH
IPC1752 MATERIAL DECLARATION TQFP64 (14 X 14 mm) (AZ64)_ASEK_CuPd WIRE_PURE Sn_ SUMITOMO CRM1076_SUMITOMO EMEG631
IPC1752 MATERIAL DECLARATION DFN8 (5X6X 0.75 mm) (LH08)_UTAC THAILAND_CuPd WIRE_NiPdAu_HENKEL 8600_SUMITOMO EMEG770HCD
IPC1752 MATERIAL DECLARATION QFN40 (6X6X 0.6 mm) (LQ40)_CML_Au WIRE_NiPdAu_HENKEL QMI519_NITTO GE7470
IPC1752 MATERIAL DECLARATION FBGA209 (14X22X1.76 mm) (BB209)_ASEK_CuPd WIRE_SnPb_HENKEL 2025D_KYOCERA KEG2250
IPC1752 MATERIAL DECLARATION FLIP CHIP BGA361 (21X21X2.5 mm) (FR361)_ASEK_SnAgCu(SAC305)
IPC1752 MATERIAL DECLARATION WLCSP50 (4.5X4.0 mm) (BZ50)_ASEK_SnAgCu(SAC305)
IPC1752 MATERIAL DECLARATION WLCSP194 (7.46X4.93 mm) (FN194) ASEK_SnAgBiCu
IPC1752 MATERIAL DECLARATION WLCSP63 (4.83X2.83 mm) (FN63) ASEK_SnAgBiCuNi
IPC1752 MATERIAL DECLARATION RFCFBGA90 (8.5X8.5 mm) (FR90)_SPIL SnAgCu(Sn1.2Ag0.5Cu0.05Ni)
IPC1752 MATERIAL DECLARATION SLG48 DUAL (6.5X6.5 mm) (BF48)_SPIL_NiAu
242 BALL - FCFBGA (10X10X1.0MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
IPC1752 MATERIAL DECLARATION SOIC28 (300 mil) (SZ28)_UTAC THAILAND_CuPdAu WIRE_PURE Sn_HENKEL 8200T_SUMITOMO EME600
IPC1752 MATERIAL DECLARATION TQFP100 (14X20X1.4 mm (AZ100)_ASEK_CuPdAu WIRE_PURE Sn_ SUMITOMO CRM1076WA _SUMITOMO G631SH
IPC1752 MATERIAL DECLARATION TQFP100 (14X20X1.4 mm) (AZ100)_ASEK_Au WIRE_PURE Sn_ SUMITOMO CRM1076WA _SUMITOMO G631SH
IPC1752 MATERIAL DECLARATION TSOPII 44 (400 mil) (ZW44)_OSET_Au WIRE_PURE Sn_ SUMITOMO CRM1076WA_SUMITOMO EMEG631SH
IPC1752 MATERIAL DECLARATION WLCSP80 (3.64X3.15 mm) (FN80)_ASEK _SnAgCu(SAC405)
IPC1752 MATERIAL DECLARATION QFN48 (7X7X1.0 mm) (LT/LY48)_CML_Au WIRE_NiPdAu_HENKEL QMI519_SUMITOMO EMEG700Y
IPC1752 MATERIAL DECLARATION TSOP32 (8X13.4 mm) (ZB32)_OSET_Au WIRE_PURE Sn_SUMITOMO CRM1076WA_SUMITOMO G631SH
IPC1752 MATERIAL DECLARATION TSOP32 (8X13.4X1.2 mm) (ZB32)_OSET_CuPdAu WIRE_PURE Sn_SUMITOMO CRM1076_SUMITOMO EMEG631SH
IPC1752 MATERIAL DECLARATION TQFP 48L (7X7 mm) (AZ48)_OSET_CuPdAu WIRE_PURE Sn_SUMITOMO CRM1076_SUMITOMO EME-G631
IPC1752 MATERIAL DECLARATION FCFBGA 252 (10X10X1.0 mm) (FR0BF)_SIGNETIC KOREA_SnAgCuNi(SAC125)_PANASONIC CV8715 _ NITTO DENKO EM-760_HITACHI CEL 9200HF
IPC1752 MATERIAL DECLARATION TSOPI 48 STACK DIE (12X18.4 mm) (ZT_ZS48)_OSET_Au WIRE_PURE Sn_NITTO EM760L2_HITACHI CEL9200HFU
IPC1752 MATERIAL DECLARATION QFN32 (5X5X0.6 mm) (LQ32)_UTAC THAILAND_CuPd Au WIRE_NiPdAu_HENKEL 8006NS_SUMITOMO EME G770HCD
IPC1752 MATERIAL DECLARATION SOIC20 (300 mil) (SZ20)_AMKOR PHIL AuPd WIRE_PURE Sn_HENKEL 8290_SUMITOMO EMEG600
IPC1752 MATERIAL DECLARATION TSOPII 44L (400 mil) (ZW44)_CML_CuPdAu_NiPdAu_HENKEL QMI509_KYOCERA KE-G6000DA
IPC1752 MATERIAL DECLARATION QFN60 (7X7X0.9 mm) (LT60A)_SPIL_CuPdAu WIRE_PURE Sn_HITACHI EN4900G_HITACHI CEL9240HF
IPC1752 MATERIAL DECLARATION QFN24 (4X4 mm) (LD24)_ASEK_Au WIRE_NiPdAu_HITACHI EN4900F_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION QFN32 (5X5X0.6 mm) (LQ32)_ASEK_CuPd WIRE_PURE Sn_ HITACHI EN4900F_SUMITOMO EMEG700LA
IPC1752 MATERIAL DECLARATION FCFBGA242 (10X10X1.0 mm) (FR0BD)_SIGNETIC_SnAgCuNi (98.25Sn/1.2Ag/0.5Cu/0.05Ni)_Panasonic CV8715CT
IPC1752 MATERIAL DECLARATION FBGA48 DIE STACK-4 (8X9.5X 1.4 mm) (BK48L)_ASEK_Au WIRE_SnAgCu(SAC405)_NEX130E4X_KYOCERA G2270
IPC1752 MATERIAL DECLARATION WLCSP182 (7.6X4.8 mm) (FN182) SPIL SnAgCuBi
IPC1752 MATERIAL DECLARATION WLCSP138 (6.504X5.554 mm) (FN138)_SPIL_SnAgCu(SAC 305)
IPC1752 MATERIAL DECLARATION WLCSP138 (5.664X4.454 mm) (FN138)_SPIL_SnAgCu(SAC405)
IPC1752 MATERIAL DECLARATION FCFBGA49 (4X4.5 mm) (FR49)_SPIL SnAgCu(SAC105)
IPC1752 MATERIAL DECLARATION QFN56 (7X7 mm) (LT56)_SPIL_CuPd WIRE_PURE Sn_SUMITOMO CRM1033BF_HITACHI CEL9240HF
252 BALL - FCFBGA (10X10X1.0MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
IPC1752 MATERIAL DECLARATION WLCSP42 (3.04X2.53 mm) (FN42)_ASEK_SnAgCu(SAC405)
IPC1752 MATERIAL DECLARATION WLCSP316 (5.808X4.9174 mm)(FN316)_PTI_SnAg(Sn98.2Ag1.8)

Pages