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Packaging | Cypress Semiconductor

Package Description Name
IPC1752 MATERIAL DECLARATION QFN32 (5X5 X0.6 mm) (LQ32)_CML_AuPd WIRE_NiPdAu_HENKEL QMI509_NITTO G7470LA
IPC1752 MATERIAL DECLARATION SOIC16 (150 mil) (SZ16) AMKOR_Cu WIRE_PURE Sn_HENKEL 8200T_SUMITOMO EME G600
IPC1752 MATERIAL DECLARATION SOJ36 (400 mil) (VZ364)_OSET_CuPdAu WIRE_PURE Sn_SUMITOMO CRM1076WA_HITACHI CEL9240HF
IPC1752 MATERIAL DECLARATION SOJ36 (400 mil) (VZ364)_OSET_Au WIRE_PURE Sn_SUMITOMO CRM1076WA_HITACHI CEL9240HF
IPC1752 MATERIAL DECLARATION SOIC18 (300 mil) (SZ18)_AMKOR PHIL_Cu WIRE_PURE Sn_HENKEL 8290_SUMITOMO G600
IPC1752 MATERIAL DECLARATION SOIC8 (150 mil) (SZ08)_AMKOR PHIL _Cu WIRE_ PURE Sn_HENKEL 8290_SUMITOMO EME G600
IPC1752 MATERIAL DECLARATION WLCSP60 (4.6X5.8 mm) (FN60B)_DECATECH_SnAgCu(SAC)
IPC1752 MATERIAL DECLARATION QFN48 (7X7X1.0 mm)(LT48D)_CML_Au WIRE_NiPdAu_HENKEL QMI519_NITTO GE7470
IPC1752 MATERIAL DECLARATION SSOP48 (300 mil) (SP48)_OSET_Au WIRE_PURE Sn_SUMITOMO CRM1076WA_SUMITOMO EMEG700SL
IPC1752 MATERIAL DECLARATION SOJ44 (400 mil) (VZ44A)_OSET_CuPdAu WIRE_PURE Sn_SUMITOMO CRM1076WA_HITACHI CEL9240HF
IPC1752 MATERIAL DECLARATION SOJ44 (400 mil) (VZ44A)_OSET_Au WIRE_PURE Sn_SUMITOMO CRM1076WA_HITACHI CEL9240HF
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product. IPC1752 MATERIAL DECLARATION SOJ32 (300 mil) (VZ323)_OSET_CuPdAu WIRE_PURE Sn_SUMITOMO CRM1076WA_HITACHI CEL9240HF
IPC1752 MATERIAL DECLARATION SOJ32 (300 mil) (VZ323)_OSET_Au WIRE_PURE Sn_SUMITOMO CRM1076WA_HITACHI CEL9240HF
IPC1752 MATERIAL DECLARATION QFN48 (7X7X1 mm) (LT48D)_ASEK_AuPd WIRE_NiPdAu_HITACHI EN4900_SUMITOMO G631
IPC1752 MATERIAL DECLARATION WLCSP104 (FM104) (3.841X5.0X0.65 mm)_STATSCHIPPAC_SnAgCu(SAC405)
IPC1752 MATERIAL DECLARATION VFBGA 124 (9X9X1.0 mm) (BZ124)_ASEK_CuPdAu WIRE_SnAgCu(SAC305)_HENKEL 2100A_KYOCERA KEG1250LKS
IPC1752 MATERIAL DECLARATION WLCSP134 (3.27X 3.18 mm) (FL134)_ASEK_SNAG
IPC1752 MATERIAL DECLARATION VFBGA116 (5.2X6.4X0.7 mm) (BZ116)_BKK_Au WIRE_SnAgCu(SAC105)_SHINETSU KMC3580LVA_HITACHI HR9070
IPC1752 MATERIAL DECLARATION FLIP CHIP BGA52 (11.5X11.5X0.80 mm) (FR52A)_ ASEK_SnAgCuNi
IPC1752 MATERIAL DECLARATION FLIP CHIP BGA73BALL (8.87X9.269X0.70 mm) (FR73)_ASEK_SnAgCuNi
IPC1752 MATERIAL DECLARATION FLIP CHIP BGA 49 (7X6X1.2 mm) (FR49)_SPIL_SnAgCuNiGe
IPC1752 MATERIAL DECLARATION FBGA96 (6X6 mm) (BZ96A/VDM096)_BKK_CuPdAu WIRE_SnAgCu(SAC305)_HENKEL QMI546_ SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION DF8N (5X6X0.8 mm) (WND008)_ASEC_CuPdAu WIRE_PURE Sn_HITACHI EN4900_SUMITOMO G700SLA
IPC1752 MATERIAL DECLARATION BGA54 IOT (4X4.5 mm) (BZ50A)_STATSCHIPPAC JIANGYIN_CuPd WIRE_SnAgCu(SAC305)_HENKEL ATB120U_KYOCERA KE-G1250LKDS
IPC 1752 MATERIAL DECLARATION 50L-IoT? BGA (BZ50A) 4X4.5 MM) STATSCHIPPAC SHANGHAI SNAGCU-CUPD WIRE
IPC1752 MATERIAL DECLARATION BGA63 IOT (BK64A) (7X7 mm)_STATSCHIPPAC JIANGYINI_CuPd WIRE_SnAgCu(SAC305)_HENKEL 2025D_KYOCERA G1250
IPC1752 MATERIAL DECLARATION WLCSP16 (1.47X1.57X0.42 mm) (FN16)_ASEK_SnAgCu(SAC405)
IPC1752 MATERIAL DECLARATION WLCSP16 (1.47X1.57X0.42 mm) (FN16)_DECATECH_SnAgCu(SAC405)
IPC1752 MATERIAL DECLARATION FBGA48 (6X10 MM) STACK DIE (BK48)_ASEK_Cu WIRE_SnAgCu(SAC405)_HENKEL ATB125_KYOCERA G2270
IPC1752 MATERIAL DECLARATION FBGA119 (14X22X 1.96 mm) (BZ119)_ASEK_CuPdAu WIRE_SnAgCuSAC405)_HENKEL 2025D_KYOCERA G2250
IPC1752 MATERIAL DECLARATION LQFP64 (10X10X1.7 mm) (AZ64)_CML CuPdAu WIRE_NiPdAu_HENKEL QMI509_KYOCERA G6000DA
IPC1752 MATERIAL DECLARATION WLBGA128 (4.51X5.43X0.60 mm) (FN128)_ASEK_SnAgCuBi(SNAG4.0CU0.5BI3.0)
IPC1752 MATERIAL DECLARATION WLCSP192 (7.63 X 4.83 mm) (FN192) ASEK_ SnAgCu(SAC305)
IPC1752 MATERIAL DECLARATION WLCSP16 (1.528 X 1.427MM) (FN16B)_ASEK_SnAgCu(SAC405)
IPC1752 MATERIAL DECLARATION QFN40 (6X6 mm) (LD40) WETTABLE FLANK_ ASEK_Au WIRE_NiPdAu_HITACHI EN4900_SUMITOMO EME G700L
IPC1752 MATERIAL DECLARATION QFN40 (6X6 mm) (LQ40)_UTAC THAILAND_CuPd WIRE_NiPdAu_HENKEL 8006NS_SUMITOMO EME G770HCD
IPC1752 MATERIAL DECLARATION LQFP100 (14X14 mm) (AZ100)_ASEK_Au WIRE_PURE Sn_HITACHI EN4900F_SUMITOMO G631H
IPC1752 MATERIAL DECLARATION SOIC 28L (300 MIL) (SZ28)_UTAC THAILAND_AU WIRE_PURE SN_HENKEL 8200T_SUMITOMO EME G600
IPC1752 MATERIAL DECLARATION SOIC32 (450 mil) (SZ32)_OSET_CuPdAu WIRE_PURE Sn_SUMITOMO CRM1076WA_SUMITOMO G631SH
IPC1752 MATERIAL DECLARATION SOIC32 (450 mils) (SZ32)_OSET_Au WIRE_PURE Sn_SUMITOMO CRM1076WA_SUMITOMO G631SH
IPC1752 MATERIAL DECLARATION BGA124 (9X9X1.0 mm) (BZ124)_BKK_CuPdAu_SnAgCu(SAC305)_HENKEL QMI546_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION QFN40 (6X6 mm) (LQ40)_ASEK_ Au WIRE_NiPdAu_HITACHI EN4900F_SUMITOMO G700L
IPC1752 MATERIAL DECLARATION SSOP56 (300 mil) (SP56)_OSET_CuPdAu WIRE_PURE Sn_SUMITOMO CRM1076_SUMITOMO EMEG700L
IPC1752 MATERIAL DECLARATION SSOP56 (300 mil) (SP56)_OSET_Au WIRE_PURE Sn_SUMITOMO CRM1076_SUMITOMO G700L
IPC1752 MATERIAL DECLARATION TSOP II 44L (400 mil) (ZW44)_OSET_Au WIRE_PURE Sn_SUMITOMO CRM1076WA_SUMITOMO G770HCD
IPC1752 MATERIAL DECLARATION TSOPII 44 (400 mil) (ZW44)_OSET_CuPdAu_PURE Sn_SUMITOMO CRM1076WA_SUMITOMO EMEG631
IPC1752 MATERIAL DECLARATION TSOPI 28 (8X13.4 mm) (ZT28)_OSET_CuPdAu WIRE_PURE Sn_SUMITOMO CRM1076_SUMITOMO EMEG631SH
IPC1752 MATERIAL DECLARATION DFN 8 (5X6X0.75 mm) (LH08)_UTAC THAILAND_Au WIRE_PURE Sn_HITACHI HR-5104_SUMITOMO G770HCD
IPC1752 MATERIAL DECLARATION TQFP44 (10X10X1.4 mm) (AZ44)_ASET_Au WIRE_PURE Sn_HITACHI FH900_SUMITOMO G631H
IPC1752 MATERIAL DECLARATION TQFP44 (10X10X1.4 mm) (AZ44)_ASEK_Cu WIRE_PURE Sn_HITACHI FH900_SUMITOMO G631H

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