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Packaging | Cypress Semiconductor

Package Description Name
IPC1752 MATERIAL DECLARATION LQFP 48 (LQA048)_J-D USUKI_Au WIRE_PURE Sn_HITACHI CEL9210HF
IPC1752 MATERIAL DECLARATION LQFP48 (7X7X1.7 mm) (LQA048)_ J-D USUKI_Au WIRE_SnBi_HITACHI EN4600B_HITACHI CEL9210HFS
IPC 1752 Material Declaration QFP 48 (PQA048) (E1) - J-devices Miyagi - Au Wire
IPC1752 MATERIAL DECLARATION TSSOP 24 (7.8X4.4X1.2 mm) (STI024)_NANTONG_Au WIRE_SnBi_SUITOMO G700LA
IPC1752 MATERIAL DECLARATION TSSOP8 (2.93X4.4X1.2 mm) (STA008)_NANTONG_Au WIRE_SnBi_HENKEL 8200T_NITTO MP8000CH4
IPC 1752 Material Declaration SOP 24 (SOL024) (E2) - Nantong Fujitsu - Cu Wire
IPC1752 MATERIAL DECLARATION SOP20 (12.7X.5X2.65 mm) (SOJ020)_NANTONG_Au WIRE_PURE Sn_HENKEL 8352_HITACHI CEL9210HFVL
Material Declaration Datasheet (MDDS) - LQFP 120 (LQM120) - J-devices/Usuki - CuPd Wire
IPC1752 MATERIAL DECLARATION SOIC16 (10.3X7.5X2.55 mm) (SO3016)_ZKT_CuPd WIRE_PURE Sn_YIZBOND 8511_SAMSUNG 8300HKT
24- BGA (6 x 8 mm) Stack Die with 5x5 Ball Matrix Pb-Free Package Material Declaration Datasheet
Material Declaration Datasheet (MDDS) - SOIC008 (SOC008) - UTAC - CuPd Wire
16L – WLCSP (1.45X1.55X0.42mm) Pb-Free Package Package Material Declaration Datasheet
IPC1752 MATERIAL DECLARATION FBGA24 (6x8x1.2 mm) (FAC024)_BKK_CuPd WIRE_SnAgCu(SAC305)_SUMITOMO CRM-1577DB_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION TSOP56 (18.4x14x1 mm) (TS056)_BKK_Au WIRE_Pure Sn_HENKEL 8340_HITACHI CEL9200HF10
IPC1752 MATERIAL DECLARATION FBGA 48 (6x4 mm) (VDF048)_BKK_CuPd WIRE_SnAgCu(SAC105)_HENKEL QMI546_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION TSOP48 (TS048)_BKK_Au WIRE_PURE Sn_HENKEL 8340_HITACHI CEL 9200HF10
IPC1752 MATERIAL DECLARATION TSOP48 (18.4X12X1 mm) (TS048)_BKK_ Au WIRE_PURE Sn_HENKEL 8340_Sumitomo EME G700L
IPC1752 MATERIAL DECLARATION FBGA64 (13X11 mm) (LAA064)_BKK_Au WIRE_SnAgCu(SAC305)_HENKEL QMI546_HITACHI CEL9200ZHF
IPC1752 MATERIAL DECLARATION FBGA24 (6X8X1.2 mm) (FAB024)_BKK_CuPd WIRE_SnAgCu(SAC305)_SUMITOMO CRM1577DB_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION FBGA 48 (VBK048) - BKK - AU WIRE
Material Declaration Datasheet (MDDS) - FBGA052 (RSE052) - BKK - CuPd Wire
IPC1752 MATERIAL DECLARATION FBGA84 (11.6X8 mm) (VBH084)_BKK_Au WIRE_SnAgCu(SAC305)_HENKEL QMI546_HITACHI 9200ZHF
48 - UFBGA (4.3X4.3X0.6MM) PB-FREE PACKAGE MATERIAL DECLARATION DATASHEET
Material Declaration Datasheet (MDDS) - FBGA056 (NLB056) - BKK - Au Wire
Material Declaration Datasheet (MDDS) - FBGA048 (VDF048) - BKK - Au Wire
IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements.  The composition table were based from the Material Declaration Datasheet of the materials use on the product. IPC1752 MATERIAL DECLARATION TSOP48 (12X18.4x1 mm) (TS048) NOR_BKK_Cu WIRE_PURE Sn_HENKEL 8340_HITACHI CEL 9200HF
Material Declaration Datasheet (MDDS) - QFP (MLF-120LQV61) (E2) - Au Wire
Material Declaration Datasheet (MDDS) - LQFP 80 (LQH080) (E2) - J-devices/Usuki - CuPd Wire
Material Declaration Datasheet (MDDS) - LQFP 80 (LQH080) (E2) - J-devices/Usuki - Au Wire
Material Declaration Datasheet (MDDS) - LQFP 80 (LQH080) (E1) - J-devices/Usuki - CuPd Wire
Material Declaration Datasheet (MDDS) - QFN (QFN48LB) (E1) - Au Wire
Material Declaration Datasheet (MDDS) - QFN (QFN48LAR) (E2) - Au Wire
Material Declaration Datasheet (MDDS) - QFP (MLF-120QSRF4) (E1) - Au Wire
Material Declaration Datasheet (MDDS) - QFP (MLF-120LQV61) (E1) - Au Wire
Material Declaration Datasheet (MDDS) - LQFP 80 (LQH080) (E1) - J-devices/Usuki - Au Wire
Material Declaration Datasheet (MDDS) - FBGA048 (VBK048) - BKK - CuPd
Material Declaration Datasheet (MDDS) - QFP (MLF-120LQV6) (E2) - Au Wire
IPC1752 MATERIAL DECLARATON SOIC 8 (150 mil) (SZ815)_UTAC THAILAND_CuPd WIRE_PURE Sn_HENKEL 8600_SUMITOMO EME G600
IPC1752 MATERIAL DECLARATION PDIP8 (300 mil) (PZ08)_UTAC THAILAND_CuPd WIRE_PURE Sn_HENKEL 8200T_SUMITOMO G770HCD
IPC1752 MATERIAL DECLARATION PDIP8 (300 mil) (PZ08)_UTAC THAILAND_CuPd WIRE_PURE Sn_HENKEL 8200T_SUMITOMO G600
IPC1752 MATERIAL DECLARATION DFN8 (4X4.5X0.8 mm) (LH08)_UTAC THAILAND_CuPd WIRE_HENKEL 8200T_SUMITOMO EMEG770
Material Declaration Datasheet (MDDS) - QFP 80 (PQG080) (E1) - J-devices/Usuki - Au Wire
Material Declaration Datasheet (MDDS) - QFP 64 (PQF064) (E1) - J-devices/Usuki - Au Wire
Material Declaration Datasheet (MDDS) - QFN (QFN32A) (E1) - Au Wire
Material Declaration Datasheet (MDDS) - QFN (QFN20LA) (E1) - Au Wire
Material Declaration Datasheet (MDDS) - DIP (SDIP32A) (E1) - Au Wire
Material Declaration Datasheet (MDDS) - DIP (DIP16A) (E1) - Au Wire
Material Declaration Datasheet (MDDS) - FBGA024 (ZSA024) - BKK - CuPd Wire
Material Declaration Datasheet (MDDS) - eMMC153 (RLH153) - STS KOREA - Au Wire
Material Declaration Datasheet (MDDS) - SOIC3016 (SO3016) - ASECL - Au Wire

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