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Packaging | Cypress Semiconductor

Package Description Name
IPC1752 MATERIAL DECLARATION FBGA64 (LSH064)_BKK_CuPdAu WIRE_SnAgCu(SAC305)_HENKEL QMI546_HITACHI FH-4026T_SHINETSU KMC 3580LVA
IPC1752 MATERIAL DECLARATION WLCSP153 (2.87X4.87X0.33MM)(FL0AB) PTI SINGAPORE_SNAG(SAG1.8)
IPC1752_MATERIAL DECLARATION WLCSP42 (3.01X2.50X0.60 MM)(FN42C) PTI SINGAPORE_SNAGBICU(SAC0307Bi)
IPC1752 MATERIAL DECLARATION TSSOP20 (4.4 mml) (ZZ20)_GREATEK_CuPdAu WIRE_PURE Sn_HITACHI EN4900G_SUMITOMO G700HA
IPC1752 MATERIAL DECLARATION QFN56 (7X7X0.6 MM) (LQ56)_CML_CUPDAU WIRE_NIPDAU_HENKEL QMI519_SUMITOMO G700Y
IPC 1752 MATERIAL DECLARATION_Ex-LQFP208 (28 X 28 X 1.7 mm) (LER208)_J-Devices-Fukuoka_CuPdAu wire_Sn_EN4600B_G660B
IPC1752 MATERIAL DECLARATION_FBGA48 (8X9.5X1.4 MM) (BK48L)_ASEK_CUPDAU WIRE_SAC305_ABLESTIK ATB-125_KYOCERA KE-G1250AAS
IPC1752 MATERIAL DECLARATION_TQFP 100 (14X14X1.4MM) (AZ100)_CML_CuPdAu WIRE_NiPdAu_HENKEL QMI509_KYOCERA KEG3000DA
IPC1752 MATERIAL DECLARATION TSSOP20 (4.4 mml) (ZZ20)_GREATEK_Au WIRE_PURE Sn_HITACHI EN4900G_SUMITOMO G700HA
IPC1752 MATERIAL DECLARATION SOIC 8 (5.28X5.28X2.16 mm) (SOC008)_ZKT_Au WIRE_PURE Sn_SAMSUNG SG8300HKT_YIZBOND 8511
IPC1752 MATERIAL DECLARATION SOIC8 (5.28X5.28X2.16 mm) (SOC008)_ZKT_CuPd WIRE_PURE Sn_SAMSUNG SG8300HKT_YIZBOND 8511
IPC1752 MATERIAL DECLARATION QFN56 (7X7X1.0 mm) (LT56D)_ASEK_CuPdAu WIRE_PURE Sn_HITACHI EN4900F_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION SOIC 8 (5.28X5.28X2.16 mm) (SOC008) - GREATEK - CUPDAu WIRE - MATTE TIN - HITACHI EN-4900GC - SUMITOMO G700SLA
IPC1752 MATERIAL DECLARATION_WLBGA194 (5.2X7.7X0.55MM) (FN0AS)_ASEK_SNAGCUBI(SAC405)
IPC1752 MATERIAL DECLARATION QFN24 (4.0X4.0 mm) (LQ24)_ASEK_CuPd WIRE_PURE Sn_HITACHI FH-900_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION QFN56 (7X7X0.9 mm) (LT56C)_ASEK_CuPdAu WIRE_PURE Sn_HITACHI EN4900F_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION SOIC8 (3.9X4.9X1.6 mm) (SOA008)_GREATEK_Au WIRE_PURE Sn_HITACHI EN4900GC_SUMITOMO G700HA
IPC1752_MATERIAL DECLARATION WLCSP69 (4.53X2.93X0.55 MM)(FN69A) PTI SINGAPORE_SNAGBICU(SAC0307Bi)
IPC1752_MATERIAL DECLARATION WLCSP145 (4.87X5.413X0.55 MM)(FN0AG) PTI SINGAPORE_SNAGBICU
IPC1752_MATERIAL DECLARATION WLCSP133 (4.89X5.33X0.55 MM)(FN0AB) PTI SINGAPORE_SNAGBICU
IPC 1752 Material Declaration_ FBGA81(8.0 X 8.0 mm) (BK81A)_SB_CuPdAu Wire_SnAgCu(SAC305)_HITACHI HR5104_SHINETSU KMC3580LVA
IPC 1752 Material Declaration_ FBGA64 (7.0 X 7.0 mm) (BK64A)_SB_CuPdAu Wire_SnAgCu(SAC305)_HENKEL QMI546_SHINETSU KMC3580LVA
IPC 1752 Material Declaration_ FBGA50 (4.5 X 4.0 mm) (BZ50A)_SB_CuPdAu Wire_SnAgCu(SAC305)_HITACHI HR5104_SHINETSU KMC3580LVA
IPC 1752 Material Declaration_ FCFBGA49 (4.5 X 4 mm) (FR49A 4L Substrate)_SB_Flip Chip_SnAgCu(SAC125)_Panasonic CV8710TAC
IPC 1752 Material Declaration_ FCFBGA49 (4.5 X 4 mm) (FR49A 2L Substrate)_SB_Flip Chip_SnAgCu(SAC125)_Panasonic CV8710TAC
IPC1752 MATERIAL DECLARATION_QFN24 (4X4X0.6 MM) (LQ24A)_GREATEK_CUPDAU WIRE_PURE SN_NITTO EM430 HITACHI EN-4900LR_SUMITOMO G700H
IPC1752 MATERIAL DECLARATION QFN40 (6X6X0.6MM) (LD40B)_ASEK_CUPDAU WIRE_PURE SN_HITACHI EN4900F_SUMITOMO G700LA
IPC1752 MATERIAL DECLARATION FBGA24 (6X8X1.2 mm) (FAB024)_BKK_CuPd WIRE_SnAgCu(SAC305)_HITACHI EN4310_SHINETSU KMC3580LVA
IPC1752 MATERIAL DECLARATION TQFP 100 (14X14X1.4MM) (AZ0AB)_ASEK_AU WIRE_PURE SN_ HITACHI EN4900_SUMITOMO G631SH
IPC1752 MATERIAL DECLARATION TQFP48 (7X7 mm) (AZ48)_GREATEK_CuPdAu_PURE Sn_HITACHI 4900G_SUMITOMO G700HA
IPC1752 MATERIAL DECLARATION SOIC16 (300 mil) (SZ16)_GREATEK_CuPdAu WIRE_PURE Sn_HITACHI EN4900G_SUMITOMO G700HA
IPC1752 MATERIAL DECLARATION SOIC16 (300 mil) (SZ16)_GREATEK_Au WIRE_PURE Sn_HITACHI EN4900G_SUMITOMO G700HA
IPC1752_MATERIAL DECLARATION WLCSP128 (4.51X5.43X0.60 MM)(FN0AN) PTI SINGAPORE_SNAGBICU
IPC1752_MATERIAL DECLARATION WLCSP109 (4.08X4.48X0.55 MM)(FN0AA) PTI SINGAPORE_SNAGBIC
IPC1752 MATERIAL DECLARATION_QFN40 (5X5X0.6MM) (LQ40D)_ASEK_CUPDAU WIRE_PURE SN_HITACHI EN4900F_SUMITOMO G700LA
IPC 1752 Material Declaration_ FCFBGA338 (10 X 10 mm) (FR0CA 2L Substrate)_SB_Flip Chip_SnAgCu(SAC125)_Panasonic CV8710TAC
IPC 1752 Material Declaration_ FCFBGA300 (9 X 9 mm) (FR0CC 4L Substrate)_SB_Flip Chip_SnAgCu(SAC125)_Panasonic CV8710TAC
IPC 1752 Material Declaration_ FCFBGA252 (10 X 10 mm) (FR0BC 4L Substrate)_SB_Flip Chip_SnAgCu(SAC125)_Panasonic CV8710TAC
IPC1752 MATERIAL DECLARATION TSOP1 56L (14X18.4X1.2MM ) (TS56)_BKK_CU WIRE_PURE SN_SUMITOMO CRM-1150B_HITACHI CEL 9200HF
IPC 1752 MATERIAL DECLARATION_PBGA416 (27X27X2.37 MM)(PAB416)_J-Devices-Hakodate_Au wire_ SNAGCU(SAC305)_EN4900F1_CEL9700HF
IPC1752 MATERIAL DECLARATION WLCSP 99 (5.965 X 5.217MM) (FN99A)_ASEK_SnAgCu (SAC405)
IPC1752 MATERIAL DECLARATION SOIC 8 (SOC008) - UNIMOS - CUPD WIRE - MATTE TIN - NTTO EM710 - HITACHI CEL-9240
"IPC 1752 is the Standard for the exchange of materials declaration data developed by component manufacturers to standardize the material declaration based from Industry Standard requirements. The composition table were based from the Material Declaration Datasheet of the materials use on the product." IPC1752 MATERIAL DECLARATION SOIC16 (10.3X7.5X 2.65 MM) (SO3016)_ ASECL_CUPDAU WIRE_PURE SN__NITTO EM710_SUMITOMO G700SLA
IPC1752 MATERIAL DECLARATION_ BGA24 (8.0X8.0X1.0MM) (VAC024)_BKK_CUPDAU WIRE_SNAGCU(SAC305)_HENKEL QMI546_SHINETSU KMC3580
IPC1752 MATERIAL DECLARATION_ TSOPI 48 (18.4X12X1.2 MM) (ZT48A)_BKK_CUPDAU WIRE_ PURE TIN_SUMITOMO CRM-1150B_HITACHI CEL9200HF
IPC Material Declaration SZ16 (300 MILS) (SZ16)_CML_NiPaAu_Au_Henkel QMI509_Kyocera KEG6000DA
IPC1752 MATERIAL DECLARATION_QFN 40 (6 X 6 X 0.6 MM)_(LQ40) _CML_CUPDAU WIRE_NIPDAU_HENKEL QMI519_NITTO GE7470
IPC1752 MATERIAL DECLARATION_TSOPI 48 (12 X 18.4 MM) (ZT48)_BKK_AuPdCu Wire_Pure Sn_HITACHI HR-9070_HITACHI CEL9200HF10U
IPC1752_MATERIAL DECLARATION WLCSP194 (4.97X7.50X0.55 MM) (FN0AL) PTI SINGAPORE_SNAGBICU
IPC1752 MATERIAL DECLARATION QFN68 (8X8X1.0 mm) (LT68)_CML_CuPdAu WIRE_NiPdAu_SUMITOMO CRM1577E_KYOCERA KEG3000N-AS

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