Cypresss SVTC Installs 200- and 300-mm Lithography Cell, Becoming the First R&D Services Provider To Offer 65 nm Technology for Advanced Chip Development | Cypress Semiconductor
Cypresss SVTC Installs 200- and 300-mm Lithography Cell, Becoming the First R&D Services Provider To Offer 65 nm Technology for Advanced Chip Development
New ASML Equipment Will Enable SVTC Customers to Characterize Manufacturing Processes Using Industry-Leading, Nanometer-Scale Technology
SAN JOSE, Calif., October 26, 2004 - Silicon Valley Technology Center (SVTC), a division of Cypress Semiconductor Corp. (NYSE:CY), has become the first R&D services provider offering 65 nm silicon processing capabilities to third-party companies with the installation of a new 200- and 300-mm wafer photolithography tool from ASML (NASDAQ:ASML). The new ASML TWINSCAN(TM) XT:1250, a high numerical aperture (0.85), 193 nm scanner, will be available to established and startup companies who are looking for advanced lithography capabilities on the sub-90-nm technology nodes. In addition to the litho cell, the processing cluster includes a resist coat and develop track, along with associated CD-SEM and overlay metrology tools.
"This new lithography cell puts SVTC's world-class capabilities inline with the advanced technology development forecast of the International Technology Roadmap for Semiconductors," said Bert Bruggeman, SVTC's managing director. "SVTC provides cutting-edge lithography services for companies that want to develop their novel silicon processes at the most progressive technology nodes available today."
In addition to this new module, SVTC customers have access to Cypress's expertise and fab space. SVTC offers an alternative strategy for taking a product from proof-of-concept to manufacturing through a state-of-the-art, foundry-compatible toolset in a 16,000 square-foot clean room in Silicon Valley. Customers are also able to tap more than 20 years of process development expertise. SVTC offers best practices in fab process engineering, statistical process control, quality management, failure analysis, and design for manufacturing methodologies as part of its development toolbox.
About ASML's TWINSCAN(TM) XT:125
ASML's TWINSCAN(TM) XT:1250 is a 193 nm, high numerical aperture (NA) step and scan lithography tool designed for volume 200 mm and 300 mm wafer production at 70 nm resolution. The TWINSCAN(TM) XT:1250 combines the imaging power of a variable 0.60-0.85 NA, 4X 193-nm Zeiss Starlith(TM) reduction lens with AERIAL(TM) II Illuminator technology, extending ArF to the 65 nm technology node.
Cypress Semiconductor Corp. (NYSE: CY) is Connecting From Last Mile to First Mile(TM) with high-performance solutions for personal, network access, enterprise, metro switch, and core communications-system applications. Cypress Connects(TM) using wireless, wireline, digital and optical transmission standards, including USB, Fibre Channel, SONET/SDH, Gigabit Ethernet and DWDM. Leveraging its process and system-level expertise, Cypress makes industry-leading physical layer devices, framers and network search engines, along with a broad portfolio of high-bandwidth memories, timing technology solutions and reconfigurable mixed-signal arrays. More information about Cypress is accessible online at https://www.cypress.com.
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TWINSCAN, Starlith and AERIAL are trademarks of ASML. Cypress and the Cypress logo are registered trademarks of Cypress Semiconductor Corporation. "Connecting from Last Mile to First Mile," and "Cypress Connects" are trademarks of Cypress. All other trademarks are the properties of their respective owners.