Cypress' Manufacturing Director to Speak at the 9th International Conference | Cypress Semiconductor
Cypress' Manufacturing Director to Speak at the 9th International Conference
Presentation to Outline Benchmark Statistics of Customer Preferences for Lead-Free Packaging Options
SAN JOSE, Calif., August 8, 2005 - Cypress Semiconductor Corp. (NYSE: CY), today announced that its manufacturing director, John Quist, will present trends in lead-free packaging options at the 9th International Conference on Lead-Free Electronic Components and Assemblies to be held at the Grand Hyatt Hotel in Singapore, on Friday, August 19, 2005 at 2:45 p.m., local time.
Quist's presentation, "NiPdAu (Nickel-Palladium-Gold) Leadframe Packages: Matching Capacity with Customer Demand," will discuss trends for overall customer acceptance of two lead-free packaging solutions, Sn (Tin) and NiPdAu. Customer preference for these solutions varies widely, as does the manufacturing capacity for both Sn and NiPdAu. Benchmark data will also be presented to demonstrate how to align supplier support with customer demand.
For more information on the 9th International Conference on Lead-Free Electronic Components and Assemblies please visit: http://www.ipc.org/
Cypress solutions are at the heart of any system that is built to perform: consumer, computation, data communications, automotive, industrial, and solar power." Leveraging a strong commitment to customer service and performance-based process and manufacturing expertise, Cypress's product portfolio includes a broad selection of wired and wireless USB devices, CMOS image sensors, timing solutions, network search engines, specialty memories, high-bandwidth synchronous and micropower memory products, optical solutions, and reconfigurable mixed-signal arrays. Cypress stock is traded on the New York Stock Exchange under the ticker symbol CY. More information about the company is available online at https://www.cypress.com.
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