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Cypress and Silecs Jointly Evaluate Non-Porous, Low-k Materials for Integrated Circuits | Cypress Semiconductor

Cypress and Silecs Jointly Evaluate Non-Porous, Low-k Materials for Integrated Circuits

Last Updated: February 10, 2004

Cypress and Silecs Jointly Evaluate Non-Porous, Low-k Materials for Integrated Circuits

Program Seeks to Improve Yield, Reduce Costs and Improve Device Performance Utilizing Silecs' Proprietary Low-k Dielectric Technology
Cypress Corpcom

San Jose, Calif., February 10, 2004 - Cypress Semiconductor Corp. (NYSE: CY) and Silecs, Inc. announced today that the two companies have agreed to collaborate on the development and testing of Silecs' novel, non-porous, low-k dielectric materials in certain devices manufactured by Cypress. The key objectives are to improve speed performance, lower power consumption, reduce manufacturing costs and improve overall device yield. This project is part of Cypress's efforts to develop a robust low-k process for use in device manufacturing.

Low-k dielectrics are used in the manufacturing of advanced integrated circuit (IC) devices and are essential to achieve high-speed performance and reduced power consumption. Low-k materials, particularly porous low-k films, have proven difficult to integrate into the IC manufacturing processes. This is mainly due to their insufficient thermo-mechanical robustness, absorption of wet chemicals during processing and mismatches in thermal expansion characteristics with interconnect metals. Through molecular engineering, Silecs has developed non-porous, low-k materials to specifically overcome these issues.

"This agreement represents a natural extension of the work that has been underway at Cypress over the past year," said Dr. Jason Reid, director of engineering at Silecs

. "In the work we have done thus far, we have shown the capability of our product to significantly reduce interline capacitance, as well as its potential to eliminate certain costly manufacturing process steps due to superior planarization

properties. It's time now to demonstrate improved overall device performance and manufacturing yield."

"We welcome the opportunity to continue this technical evaluation with Silecs," said Bert Bruggeman, director of technology development at Cypress. "The Silecs technology has proved very promising in the past several months and offers an exciting, fresh approach to the implementation of low-k dielectrics in IC devices. We hope to demonstrate significant operating cost savings through the elimination of one or more dielectric chemical-mechanical polishing (CMP) process steps while improving the overall performance of our products."

About Cypress

Cypress Semiconductor Corp. (NYSE: CY) is Connecting from Last Mile to First Mile(TM) with high-performance solutions for personal, network access, enterprise, metro switch and core communications-system applications. Cypress Connects(TM) using wireless, wireline, digital, and optical transmission standards, including USB, Fibre Channel, SONET/SDH, Gigabit Ethernet and DWDM. Leveraging its process and system-level expertise, Cypress makes industry-leading physical layer devices, framers and network search engines, along with a broad portfolio of high-bandwidth memories, timing technology solutions and reconfigurable mixed-signal arrays. More information about Cypress is accessible online at

About Silecs

Silecs develops electronic chemical products specifically designed to meet the advanced requirements of the semiconductor industry, leveraging an extensive portfolio of patent pending precursor and synthesis technologies." With its application engineering strength and extensive semiconductor processing facilities at its disposal, Silecs is able to develop advanced semiconductor processes to help customers in rapid product integration. Additional information on Silecs can be found online at

Cypress and the Cypress logo are registered trademarks of Cypress Semiconductor Corporation." "Connecting from Last Mile to First Mile," and "Cypress Connects" are trademarks of Cypress. All other trademarks are the property of their respective owners.


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