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QTP# 181704: 119-Ball FBGA (14x22x1.96mm) SAC-405 Solder Ball Finish, CuPdAu Wire, MSL3, 260C Reflow, ASE-Taiwan (G) | Cypress Semiconductor

QTP# 181704: 119-Ball FBGA (14x22x1.96mm) SAC-405 Solder Ball Finish, CuPdAu Wire, MSL3, 260C Reflow, ASE-Taiwan (G)

Last Updated: 
May 16, 2018
Version: 
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QTP# 181704: 119-Ball FBGA (14x22x1.96mm) SAC-405 Solder Ball Finish, CuPdAu Wire, MSL3, 260C Reflow, ASE-Taiwan (G)