QTP# 181704: 119-Ball FBGA (14x22x1.96mm) SAC-405 Solder Ball Finish, CuPdAu Wire, MSL3, 260C Reflow, ASE-Taiwan (G) | Cypress Semiconductor
QTP# 181704: 119-Ball FBGA (14x22x1.96mm) SAC-405 Solder Ball Finish, CuPdAu Wire, MSL3, 260C Reflow, ASE-Taiwan (G)
Last Updated:
May 16, 2018
Version:
**
QTP# 181704: 119-Ball FBGA (14x22x1.96mm) SAC-405 Solder Ball Finish, CuPdAu Wire, MSL3, 260C Reflow, ASE-Taiwan (G)
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 QTP# 181704: 119-Ball FBGA (14x22x1.96mm) SAC-405 Solder Ball Finish, CuPdAu Wire, MSL3, 260C Reflow, ASE-Taiwan (G).pdf |
English | 157.44 KB | 05/15/2018 |