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Home › Quality & Packaging › Qualification Reports › QTP# 180307: QUALIFICATION OF NEW BLE MODULE CYBT-343026-01 WITH NEW SILICON DEVICE CYW20706UA2KFFB4G AND SFLASH CHIP FM25Q04 FROM FUDAN MICROELECTRONICS

QTP# 180307: QUALIFICATION OF NEW BLE MODULE CYBT-343026-01 WITH NEW SILICON DEVICE CYW20706UA2KFFB4G AND SFLASH CHIP FM25Q04 FROM FUDAN MICROELECTRONICS | Cypress Semiconductor

QTP# 180307: QUALIFICATION OF NEW BLE MODULE CYBT-343026-01 WITH NEW SILICON DEVICE CYW20706UA2KFFB4G AND SFLASH CHIP FM25Q04 FROM FUDAN MICROELECTRONICS

Last Updated: 
May 11, 2020
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QTP# 180307: QUALIFICATION OF NEW BLE MODULE CYBT-343026-01 WITH NEW SILICON DEVICE CYW20706UA2KFFB4G AND SFLASH CHIP FM25Q04 FROM FUDAN MICROELECTRONICS

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QTP# 180307: QUALIFICATION OF NEW BLE MODULE CYBT-343026-01 WITH NEW SILICON DEVICE CYW20706UA2KFFB4G AND SFLASH CHIP FM25Q0.pdf English 166.78 KB 05/06/2020

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