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QTP# 173503: QUALIFICATION OF NEW BLE MODULE CYBLE-013025-00 WITH NEW SILICON DEVICE CYW20737A1KML2G, AND SFLASH CHIP FM25F01 FROM FUDAN MICROELECTRONICS | Cypress Semiconductor

QTP# 173503: QUALIFICATION OF NEW BLE MODULE CYBLE-013025-00 WITH NEW SILICON DEVICE CYW20737A1KML2G, AND SFLASH CHIP FM25F01 FROM FUDAN MICROELECTRONICS

Last Updated: 
Dec 07, 2018
Version: 
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QTP# 173503: QUALIFICATION OF NEW BLE MODULE CYBLE-013025-00 WITH NEW SILICON DEVICE CYW20737A1KML2G, AND SFLASH CHIP FM25F01 FROM FUDAN MICROELECTRONICS