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QTP# 172106: 96-Ball FBGA (6x6x1.0mm) SAC-305 Solder Ball Finish, CuPd Wire, MSL3, 260C Reflow, Bangkok-Thailand (SB) | Cypress Semiconductor

QTP# 172106: 96-Ball FBGA (6x6x1.0mm) SAC-305 Solder Ball Finish, CuPd Wire, MSL3, 260C Reflow, Bangkok-Thailand (SB)

Last Updated: 
May 07, 2018
Version: 
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QTP# 172106: 96-Ball FBGA (6x6x1.0mm) SAC-305 Solder Ball Finish, CuPd Wire, MSL3, 260C Reflow, Bangkok-Thailand (SB)