QTP# 172106: 96-Ball FBGA (6x6x1.0mm) SAC-305 Solder Ball Finish, CuPd Wire, MSL3, 260C Reflow, Bangkok-Thailand (SB) | Cypress Semiconductor
QTP# 172106: 96-Ball FBGA (6x6x1.0mm) SAC-305 Solder Ball Finish, CuPd Wire, MSL3, 260C Reflow, Bangkok-Thailand (SB)
Last Updated:
May 07, 2018
Version:
**
QTP# 172106: 96-Ball FBGA (6x6x1.0mm) SAC-305 Solder Ball Finish, CuPd Wire, MSL3, 260C Reflow, Bangkok-Thailand (SB)
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 QTP# 172106: 96-Ball FBGA (6x6x1.0mm) SAC-305 Solder Ball Finish, CuPd Wire, MSL3, 260C Reflow, Bangkok-Thailand (SB).pdf |
English | 153.7 KB | 05/04/2018 |