QTP #144502: QUALIFICATION OF THE SOIC 8L (208MIL) PACKAGE AT UTL, USING 0.8MIL CUPD BOND WIRE, G770HCD, 8200T, WITH MATTE SN, AT MSL3 AND 260C | Cypress Semiconductor
QTP #144502: QUALIFICATION OF THE SOIC 8L (208MIL) PACKAGE AT UTL, USING 0.8MIL CUPD BOND WIRE, G770HCD, 8200T, WITH MATTE SN, AT MSL3 AND 260C
Last Updated:
May 13, 2019
Version:
*A
QTP #144502: QUALIFICATION OF THE SOIC 8L (208MIL) PACKAGE AT UTL, USING 0.8MIL CUPD BOND WIRE, G770HCD, 8200T, WITH MATTE SN, AT MSL3 AND 260C
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 QTP #144502: QUALIFICATION OF THE SOIC 8L (208MIL) PACKAGE AT UTL, USING 0.8MIL CUPD BOND WIRE, G770HCD, 8200T, WITH MATTE.pdf |
English | 510 KB | 05/13/2019 |