You are here

QTP #144502: QUALIFICATION OF THE SOIC 8L (208MIL) PACKAGE AT UTL, USING 0.8MIL CUPD BOND WIRE, G770HCD, 8200T, WITH MATTE SN, AT MSL3 AND 260C | Cypress Semiconductor

QTP #144502: QUALIFICATION OF THE SOIC 8L (208MIL) PACKAGE AT UTL, USING 0.8MIL CUPD BOND WIRE, G770HCD, 8200T, WITH MATTE SN, AT MSL3 AND 260C

Last Updated: 
May 13, 2019
Version: 
*A
QTP #144502: QUALIFICATION OF THE SOIC 8L (208MIL) PACKAGE AT UTL, USING 0.8MIL CUPD BOND WIRE, G770HCD, 8200T, WITH MATTE SN, AT MSL3 AND 260C