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QTP # 140501: Qualification of the PDIP 8L (300mil) package at UTL, using 0.8mil CuPd bond wire, G600 mold compound, 8200T die attach, with matte Sn lead finish | Cypress Semiconductor

QTP # 140501: Qualification of the PDIP 8L (300mil) package at UTL, using 0.8mil CuPd bond wire, G600 mold compound, 8200T die attach, with matte Sn lead finish

Last Updated: 
Sep 23, 2019
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QTP # 140501: Qualification of the PDIP 8L (300mil) package at UTL, using 0.8mil CuPd bond wire, G600 mold compound, 8200T die attach, with matte Sn lead finish