7mils Die Thickness for R9, 72Meg using 100-Lead TQFP (14x20mm), NiPdAu, MSL3,260C Reflow, CML-R Assembly | Cypress Semiconductor
7mils Die Thickness for R9, 72Meg using 100-Lead TQFP (14x20mm), NiPdAu, MSL3,260C Reflow, CML-R Assembly
Last Updated:
Feb 08, 2006
Version:
1
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 051702 rev. 1.0 100-TQFP, MSL3, CML-RA .pdf |
English | 136.13 KB | 04/21/2009 |