7mils Die Thickness for R9, 72Meg using 100-Lead TQFP (14x20mm), NiPdAu, MSL3,260C Reflow, CML-R Assembly | Cypress Semiconductor
7mils Die Thickness for R9, 72Meg using 100-Lead TQFP (14x20mm), NiPdAu, MSL3,260C Reflow, CML-R Assembly
Last Updated:
Feb 08, 2006
Version:
1