PCN990027 | Cypress Semiconductor
PCN990027
Last Updated:
May 30, 2018
Assembly Location, Molding Compound and Lead Frame Change, 28 lead SOIC
Issue Date: 30-Sep-1999
Effectivity Date: 29-Dec-1999
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN990027.pdf |
English | 21.97 KB | 05/30/2018 |