PCN990027 | Cypress Semiconductor
PCN990027
Last Updated:
May 30, 2018
Assembly Location, Molding Compound and Lead Frame Change, 28 lead SOIC
Issue Date: 30-Sep-1999
Effectivity Date: 29-Dec-1999
Assembly Location, Molding Compound and Lead Frame Change, 28 lead SOIC
Issue Date: 30-Sep-1999
Effectivity Date: 29-Dec-1999