PCN970008 | Cypress Semiconductor
PCN970008
Last Updated:
May 29, 2018
Assembly Location Change-Molding Compound 32 Lead 300 Mil SOJ Package
Issue Date: 24-Jun-1997
Effectivity Date: 22-Sep-1997
Related Files
| File Title | Language | Size | Last Updated |
|---|---|---|---|
 PCN970008.pdf |
English | 19.54 KB | 05/29/2018 |